A base member includes a via having a first hole and a second hole. When viewed from a direction in which a base surface extends, the first hole and the second hole have shapes becoming wider as getting closer to a first surface and a second surface of the base surface from a portion at which a lower end of the first hole and an upper end of the second hole are in contact with each other. When the first hole and the second hole are viewed from the direction in which the base surface extends, a smaller angle of angles formed by a generatrix of the first hole and a generatrix of the second hole is smaller in a thin region of the base member than in a thick region of the base member.

A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.

A data storage device includes a substrate and one or more grid array integrated circuit packages. The grid array integrated circuit package includes at least one self-alignment pin having a tapered shape. The substrate includes one or more connection pads to receive the grid array integrated circuit packages. The connection pads include at least one self-alignment receptacle that receives the self-alignment pins such that the grid array integrated circuit packages maintain an alignment with an associated connection pad of the substrate.

A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.

A printed circuit board includes: a plurality of insulating layers; a plurality of wiring pattern layers disposed on at least one surface of the plurality of insulating layers; a via connecting wiring pattern layers, among the plurality of wiring pattern layers, disposed on upper and lower surfaces of one of the plurality of insulating layers to each other; a connection pad disposed on a surface of an outermost layer among the plurality of insulating layers; and a solder resist having a hole exposing at least a portion of the connection pad. An external surface of the solder resist has surface roughness.

Provided are a printed circuit board and a method for manufacturing the same, the printed circuit board including: an insulating member; a first pad disposed in the insulating member; a plurality of first vias respectively disposed on a lower side of the first pad in the insulating member and connected to the first pad; and a second via disposed on an upper side of the first pad in the insulating member and connected to the first pad.

A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on an upper surface of the first insulating layer; a first circuit pattern buried in a lower region of the first insulating layer and including a first via pad; a second circuit pattern disposed between the first insulating layer and the second insulating layer and including a second via pad; a third circuit pattern buried in an upper region of the second insulating layer and including a third via pad; a first via disposed in the first insulating layer and connecting the first via pad and the second via pad; and a second via disposed in the second insulating layer and connecting the second via pad and the third via pad, and wherein at least one of an upper surface and a lower surface of the second via includes a convex portion in an upward or downward direction.

A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

An electronic device includes at least two boards and support pillars. The at least two boards include hole portions. The support pillars inserted into the hole portions such that the at least two boards are held mutually separated. The hole portions include tapered surfaces that incline toward center portions of the hole portions from a surface on a side from which the support pillars of the boards are inserted.

A printed wiring board according to an aspect of the present invention includes an insulating resin, a plated copper formed on a front surface side of the insulating resin, and a plated copper formed on a back surface side of the insulating resin. The plated copper and the plated copper are electrically connected via a plated copper that fills a through hole penetrating the insulating resin from the front surface side to the back surface side. Furthermore, the through hole includes a conical section whose opening diameter decreases from the front surface side to the back surface side of the insulating resin, and a cylindrical section that communicates with the conical section at a bottom surface of the conical section.