A printed circuit board may include: a first circuit layer; a first insulating layer disposed on the first circuit layer; a high-rigidity layer disposed on the first insulating layer; and a second circuit layer disposed on the high-rigidity layer and connected to the first circuit layer by a first via extending through the first insulating layer and the high-rigidity layer, wherein a rigidity of the high-rigidity layer is greater than a rigidity of the first insulating layer.

There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board include a glass plate, an insulating member penetrating through the glass plate, insulating layers disposed on a first surface and a second surface of the glass plate, and a via through the insulating member.

The invention relates to a method of forming a void with a circular cross section in a substrate, more particularly to forming through holes electronic substrates The method comprising the steps of causing a laser cutter to traverse in an arc to an intended circumference of the void, traversing the intended circumference of the void at least once, wherein the lead in from the arc to the circumference comprises a radius.

A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.

A circuit board having an insulating layer containing a low-temperature sintering ceramic material and wiring. The wiring includes a thermal via having an area of 0.0025 mm.sup.2 or more in top view thereof, the thermal via is a stack of layers of tapered conductors, each having tapered end faces, and each end face of the tapered conductors are in direct contact with the insulating layer.

Disclosed is an adapter panel and a method of manufacturing the same comprising a panel body having a first surface and an opposing second surface, wherein a through-hole in a frustrum shape is formed through the panel body and filled by a conical electrical conductor between the first and second surface. The conical electrical conductor has a plane end flush with the first surface and a tip end protruding from the second surface. The panel body further comprises a wiring structure on the first surface electrically connected to the plane end of the conical electrical conductor. Bonding to a dielectric plate can be achieved by directly inserting the tip end of the conical electrical conductor into a solder ball.

An exemplary bridging inter-connector establishes electrical connections between conductors on a PCB and aligned conductors on a first board mounted to the PCB. A flexible non-conductive sheet covers at least a portion of these conductors. Separated conductive strips on the sheet that are dimensioned to align with and engage at least a portion of both the aligned conductors. A thin film of a bonding agent is disposed on the separated conductive strips and located to engage at least a portion of both aligned conductors to form a conductive connection.

According to one aspect, an apparatus includes a substrate, a conductor, and a contact pad. The substrate has a first edge, and the conductor is formed on the substrate. The contact pad has a first end and a second end, and is formed on the substrate and connected to the conductor at the first end. The contact pad has a non-uniform configuration, the non-uniform configuration including a first width and a second width, the first width and the second width being measured with respect to a common axis, the first width being wider than a second width, the second width being a width of the contact pad at the second end, the second end being coincident with the first edge.

One-component, solvent-free organosiloxane composition comprising a) a linear or branched polyorganosiloxane containing at least two alkenyl or alkynyl groups, as component A; b) a linear or branched polyorganosiloxane containing at least 3 Si—H groups, as component B; c) a hydrosilylation catalyst as component C; d) an alkynol of the general formula (I) ##STR00001## wherein R.sup.1, R.sup.2, R.sup.3 are selected independently of one another from H, C.sub.1-C.sub.6-alkyl and substituted or unsubstituted C.sub.3-C.sub.6-alkyl; or R.sup.1 is selected from H, C.sub.1-C.sub.6-alkyl and substituted or unsubstituted C.sub.3-C.sub.6-cycloalkyl, and R.sup.2, R.sup.3 are bonded together and form a 3- to 8-membered ring which can be substituted by one or more C.sub.1-C.sub.3-alkyl groups, as component D; and e) a fumed silica as component E.

Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a radiation shield groove that extends past a surface of the support structure and into the support structure, a radiation source on the substrate, and a radiation shield around the radiation source, where the radiation shield includes a wall secured to the support structure and a groove channel coupling wall that extends past a surface of the support structure and into the radiation shield groove.