A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate, the circuit area surrounds the chip mounting area. The chip is mounted on the chip mounting area of the top surface and includes a bump. The circuit layer is disposed on the top surface. A connection portion of the circuit layer extends across a first side of the chip mounting area and into the chip mounting area. A transmission portion of the circuit layer is located on the circuit area and electrically connected to the connection portion. A stress release portion of the circuit layer is located between the transmission portion and a second side of the chip mounting area and is a comb-shaped structure.

A semiconductor package of an embodiment includes a wiring substrate, a semiconductor chip provided on an upper surface of the wiring substrate, a sealing resin covering surfaces of the wiring substrate and the semiconductor chip, an infrared reflection layer containing any of aluminum, aluminum oxide, and titanium oxide, and an external terminal provided on a lower surface of the wiring substrate. The wiring substrate is electrically connectable with a printed wiring board through the external terminal. The infrared reflection layer is provided to the sealing resin on an upper side of a surface of the semiconductor chip on a side opposite to an upper surface of the wiring substrate.

This application relates to the field of electronic technologies, and provides a printed circuit board and a manufacturing method thereof, and an electronic device. The printed circuit board has target holes that penetrate through the printed circuit board, and an area that is not provided with the target holes has blocking structures (B) for blocking liquid flow, where the area is on at least one side that is of the printed circuit board and that is connected to the target holes.

An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10.sup.−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10.sup.−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.

According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

A semiconductor package of an embodiment includes a wiring substrate, a semiconductor chip provided on an upper surface of the wiring substrate, a sealing resin covering surfaces of the wiring substrate and the semiconductor chip, an infrared reflection layer containing any of aluminum, aluminum oxide, and titanium oxide, and an external terminal provided on a lower surface of the wiring substrate. The wiring substrate is electrically connectable with a printed wiring board through the external terminal. The infrared reflection layer is provided to the sealing resin on an upper side of a surface of the semiconductor chip on a side opposite to an upper surface of the wiring substrate.

The present disclosure includes a method for producing a printed circuit board having at least one coating includes mixing a first component with a second component of a two component coating system to form a coating mixture by means of a dynamic mixer or by means of a static-dynamic mixer. The method also includes supplying the coating mixture to an output unit, and coating the printed circuit board by outputting the coating mixture using the output unit onto the printed circuit board. The output unit is moved automatically in at least one, two, or three dimensions relative to the printed circuit board. The mixer is connected with the output unit in such a manner that it is moved together with the output unit relative to the printed circuit board. The present disclosure also includes a coating head for performing the method.

Embodiments of the present disclosure provide a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes: a plurality of bearing parts for supporting display assemblies; and a connecting beam located between two bearing parts and connected to the two bearing parts. The connecting beam includes at least one stretchable portion with a hollow portion provided inside the stretchable portion, so that the stretchable portion is deformable in a first direction and a second direction, and the second direction is perpendicular to the first direction.

Embodiments of the present disclosure provide a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes: a plurality of bearing parts for supporting display assemblies; and a connecting beam located between two bearing parts and connected to the two bearing parts. The connecting beam includes at least one stretchable portion with a hollow portion provided inside the stretchable portion, so that the stretchable portion is deformable in a first direction and a second direction, and the second direction is perpendicular to the first direction.