A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

Disclosed is a wiring board including: an insulating substrate; a plurality of connection terminals arranged on the insulating substrate; and a plurality of non-conductive protruding parts respectively arranged on areas of the insulating substrate except areas on which the plurality of connection terminals are arranged. The non-conductive protruding parts has a height greater than that of the connection terminals.

A circuit board (10, 10, 10) includes at last one insulating substrate layer (SL1, SL2, SL3, SL4, SL5) and a plurality of electrically conductive copper coats (C1, C2, C3) arranged on the at least one insulating substrate layer (SL1, SL2, SL3, SL4, SL5), wherein at least one of the electrically conductive copper coats (C1, C2, C3) is coated at least on both sides with a layer (HSI, HS2, HS3) made of a material for inhibiting electromigration, wherein on a layer (HS1, HS2) made of a material for inhibiting electromigration a further metal layer (M1, M2, M3, M3) is provided, which is in turn coated with a further layer (HS3, HS3) made of a material for inhibiting electromigration.

Provided is a key structure including a base plate having at least one connecting seat and at least one notch adjacent to a lower portion of the connecting seat; a keycap disposed above the base plate in a liftable manner; a thin film circuit assembly disposed on the base plate and located between the base plate and the keycap; and a supporting rod connected to the keycap and the base plate and located between the thin film circuit assembly and the keycap. An accommodating space formed by the notch extends from and communicates with a through hole of the connecting seat. The connecting seat protrudes out from an opening of the thin film circuit assembly. A vertical projection region of the notch on the base plate is located within a vertical projection region of the opening on the base plate. The invention also provides a keyboard module.

A keyboard module including keys, a frame, a bottom plate, and a backlight assembly is provided. The frame has a key region. Top surfaces of the keys are exposed in the key region. The frame includes a column. The bottom plate is disposed under the frame. The bottom plate includes a bending portion. The backlight assembly is disposed under the bottom plate, and sequentially includes a light shielding sheet, a light guide plate, and a reflector. The light shielding sheet has a first opening. The light guide plate has a second opening. A part of the reflector is exposed by the first opening and the second opening. The column passes through the bending portion and is located in the first opening and the second opening. A bottom surface of the column leans against the reflector.

The disclosure provides a circuit structure including a first flexible insulating layer, a plurality of wires, and a second flexible insulating layer. The wires are stacked in parallel on the first flexible insulating layer. The second flexible insulating layer is stacked on the wires and has at least one insulating-layer opening from which a part of at least one of the wires is exposed.

A die and a substrate are provided. The die comprises at least one integrated circuit chip, and the substrate comprises first and second subsets of conductive pillars extending at least partially therethrough. Each of the first subset of conductive pillars comprises a protrusion bump pad protruding from a surface of the substrate, and the second subset of conductive pillars each partially form a trace recessed within the surface of the substrate. The die is coupled to the substrate via a plurality of conductive bumps each extending between one of the protrusion bump pads and the die.

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

A mouse including a main body, a switch module and a pressing component is provided. The switch module includes a switch member. The pressing component is disposed on the main body. The pressing component includes a pivot member, a key portion and an abutting member. The key portion is rotatable with respect to the main body through the pivot member. The abutting member is configured to provide a force for pushing the key portion to abut against the switch member.

A method for manufacturing a circuit, in particular of a hearing aid, in which method a printed circuit board is made available with a first region and with a second region which are separated by means of a boundary. A component is mounted on the printed circuit board, wherein the component is positioned on the boundary. The first region is covered by means of a mask which has an edge, wherein the edge is positioned on the component, and the printed circuit board is provided with a coating. The coating is cut away in the region of the component and the mask is removed.