A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.

A partially molded substrate and a partial molding apparatus and a method thereof, which cover and mold each of one or more conductors formed on the substrate with the insulator to prevent the sizes of the substrate from being increased due to molding, thereby efficiently preventing high voltage between the conductors on the substrate from being applied, and thereby preventing interference around the conductor.

A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein the circuit pattern layer includes a corner portion of an upper portion which has a curvature, and wherein the corner portion of the circuit pattern layer is a boundary surface between the top surface and a side surface of the circuit pattern layer, and the boundary surface has a concavely curved surface.

An LED lighting apparatus is provided. The LED lighting apparatus includes LED chips, a substrate, and an electronic element. The substrate includes a mount surface on which the LED chips are mounted. The LED chips are arranged at or near a center of the mount surface of the substrate. The substrate includes a base, a wiring pattern, and an insulating layer. The wiring pattern is formed on the base. The insulating layer is formed on the base or the wiring pattern and formed with a plurality of openings. The wiring pattern includes pad portions comprising parts of the wiring pattern, respectively. Each of the parts of the wiring pattern is exposed through one of the openings of the insulating layer as viewed in a thickness direction of the substrate. Each of the LED chips is mounted on one of the pad portions.

A semiconductor package of an embodiment includes a wiring substrate, a semiconductor chip provided on an upper surface of the wiring substrate, a sealing resin covering surfaces of the wiring substrate and the semiconductor chip, an infrared reflection layer containing any of aluminum, aluminum oxide, and titanium oxide, and an external terminal provided on a lower surface of the wiring substrate. The wiring substrate is electrically connectable with a printed wiring board through the external terminal. The infrared reflection layer is provided to the sealing resin on an upper side of a surface of the semiconductor chip on a side opposite to an upper surface of the wiring substrate.

An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a conductive electrode, and a first layer. The conductive electrode and the first layer are disposed on the base, the first layer surrounds the conductive electrode and overlaps an edge portion of the conductive electrode. In a cross-sectional view, the first layer is divided into a first part and a second part, the conductive electrode is located between the first part and the second part, and a width of the first part is different from a width of the second part.

A printed wiring board includes a substrate, a contact member arranged in contact with the substrate, and a wear resistant member fixed at least in an area on the substrate that comes in contact with the contact member, the wear resistant member having a wear resistance higher than that of the substrate.

Disclosed herein is a method. A first electrically conductive trace is provided on a substrate. A second electrically conductive trace is providing on the substrate proximate the first electrically conductive trace. A solder mask is provided at the first and the second electrically conductive traces. A portion of the first electrically conductive trace is free of any portion of the solder mask covering thereon.

An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.010.sup.8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of 40 C. and heating the article to a temperature of 125 C., and the article has a helium hermeticity of less than or equal to 1.010.sup.8 atm-cc/s after 100 hours of HAST at a temperature of 130 C. and a relative humidity of 85%.

A printed wiring board includes a copper foil pattern on a base material, a solder resist uniformly provided on the copper foil pattern so as to cover the copper foil pattern, and an outline character forming layer provided in a part where characters are not formed so that outline characters are formed on the solder resist. A method of manufacturing the printed wiring board includes a step of forming the copper foil pattern on the base material, a step of uniformly forming the solder resist on the copper foil pattern so as to cover the copper foil pattern, and a step of forming the outline character forming layer on the solder resist. The solder resist is formed by applying it by a spray method.