A wiring board is provided with: an insulating layer; a base electrode layer layered on one primary surface of the insulating layer in predetermined regions; an insulating covering layer layered on one primary surface of the insulating layer in a state covering parts of edges of the base electrode layer; and a surface electrode layer plated on exposed portions of the base electrode layer not covered by the insulating covering layer, the thickness of covered portions of the base electrode layer covered by the insulating covering layer being less than the thickness of the exposed portions. The surface electrode layer is formed only on the exposed portions of the base electrode layer.

A wiring substrate includes an insulating layer, a conductor layer formed on the insulating layer and including a conductor pad having a rectangular planar shape, and a solder resist layer formed on the insulating layer such that the solder resist layer is covering the conductor layer formed on the insulating layer. The solder resist layer has an opening formed such that the opening is exposing 50% or more of an area of a surface of the conductor pad on the opposite side with respect to the insulating layer and exposing a side surface and the surface of the conductor pad at side portions of a peripheral edge of the conductor pad and that the solder resist layer is covering the side surface and the surface of the conductor pad at one or more of corner portions of the peripheral edge of the conductor pad.

A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.

A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

A printed circuit board includes an electronic component including a first land, a printed wiring board including a resist portion and a second land, and a connecting portion interconnecting the first land and the second land. An opening larger than the first land in plan view from the electronic component side is defined in the resist portion. In plan view from the electronic component side, the first land is disposed inside the opening, the second land including a body portion disposed inside the opening and a protruding portion protruding from the body portion, the body portion being disposed further on an inside than an outer edge of the first land, and at least part of the protruding portion protruding further to an outside than the first land.

A lighting arrangement (10) is disclosed, comprising a substrate (11) for mechanically and electrically connecting at least one light-emitting element (12) thereto. The substrate (11) comprises at least a first side (13) and a second side (14), and a circumferential edge (20) along a periphery of the substrate, the circumferential edge (20) extending between the first side (13) and the second side (14), and at least one electrically conductive region (16) disposed on the first side (13). The lighting arrangement (10) comprises at least one thermally conductive element (18) arranged such that the at least one thermally conductive element (18) is coupled to at least a portion of the second side (14) and to at least a portion of an outer surface (17) of the circumferential edge (20), and such that the at least one thermally conductive element (18) is not coupled to the at least one electrically conducting region (16).

A printed circuit board includes a first chip component, a second chip component, and a printed wiring board. The first chip component and the second chip component each has a length L2 in the longitudinal direction. A relationship of 0.894≤L2/L1≤1.120 is satisfied, where L1 represents a length of the first opening in the longitudinal direction. A relationship of 0.894≤L2/L4≤1.120 is satisfied, where length L4 represents a length of the second opening in the longitudinal direction. A relationship of 0.183≤L.sub.OA/L.sub.iA≤50.309 is satisfied, where L.sub.iA represents a length of the first land in the longitudinal direction, and L.sub.OA represents a thickness of solder on an end surface of the first electrode. A relationship of 0.183≤L.sub.OB/L.sub.iB≤0.309 is satisfied, where L.sub.iB represents a length of the second land in the longitudinal direction, and L.sub.OB represents a thickness of solder on an end surface of the second electrode.

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.