The present invention relates to an improved system and method for manufacturing flexible circuit boards (FSBs) using optical alignment and various bonding systems. The invention provides an improved process to connect together the layers of rigid-flex, flexible, and printed circuit boards while maintaining alignment of the layers prior to and possibly after a lamination step. An optical alignment system is provided, a preferred arrangement is enabled as an automated pinless bonding system (PBS), for securely gripping, aligning, transferring, and clamping, bonding and moving a bonded FSB employing a multi-axis orientation. An alternative manual optical alignment and bonding system is provided.

A wiring structure includes an upper conductive structure, a lower conductive structure, an adhesion layer and at least one outer via. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The adhesion layer is interposed between the upper conductive structure and the lower conductive structure to bond the upper conductive structure and the lower conductive structure together. The outer via extends through at least a portion of the upper conductive structure and the adhesion layer, and electrically connected to the circuit layer of the lower conductive structure

Disclosed herein is a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer positioned between the lower electrode layer and the upper electrode layer. The upper electrode layer has a first capacitive electrode part opposed to the lower electrode layer through the dielectric layer without being connected to the lower electrode layer and a fiducial mark part penetrating the dielectric layer to be connected to the lower electrode layer.

Methods and devices that identify a silkscreen data file associated with a physical printed circuit board and use an image of the physical printed circuit board to display a virtual silkscreen over the image of the physical printed circuit board.

An optical waveguide is disclosed. In a disclosed embodiment, the optical waveguide includes a first aluminum nitride (AlN) thin film disposed on a layer of high-frequency polymer. A second AlN thin film is embedded in the first AlN thin film. In disclosed embodiments, the nitrogen concentration level of the first AlN thin film is different than the concentration level of the second AlN thin film.

One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.

The present disclosure relates to a machining station for machining platelike workpieces (1) by means of at least one tool, in particular a drilling station for machining at least one circuit board, as well as to a method for controlling or identifying a platelike workpiece (1). The machining station has at least one X-ray radiation source (3), at least one detector (4) and a table (2) that can be positioned between the X-ray radiation source (3) and the detector (4), on which the workpiece (1) to be machined can be fastened. The table (2) has a receiving plate (6) made out of a material permeable to X-rays (5), in particular a plastic. The receiving plate (6) has at least one suction port (11) for extracting air and a distribution grid, which is connected in terms of flow with the at least one suction port (11) and consists of several channels (10) unilaterally open in a support surface (9) with beveled and/or rounded edges (13) and/or of inclinedly running through openings (14).

The present invention relates to an improved system and method for manufacturing flexible circuit boards (FSBs) using optical alignment and various bonding systems. The invention provides an improved process to connect together the layers of rigid-flex, flexible, and printed circuit boards while maintaining alignment of the layers prior to and possibly after a lamination step. An optical alignment system is provided, a preferred arrangement is enabled as an automated pinless bonding system (PBS), for securely gripping, aligning, transferring, and clamping, bonding and moving a bonded FSB employing a multi-axis orientation. An alternative manual optical alignment and bonding system is provided.

A mark recognition device is applied to a substrate including a marked region. The mark recognition device includes; an image collecting mechanism and a first light source. The first light source emits a light beam, the light beam includes a first light beam and a second light beam. The first light beam is irradiated to the marked region of the substrate and blocked by a mark of the marked region to generate a marked orthographic projection on the image collecting mechanism. The second light beam is transmitted to the image collecting mechanism to form transmitted light. The image collecting mechanism recognizes the mark according to the marked orthographic projection of the mark and the second light beam. Recognition accuracy of the mark is effectively improved in embodiments of the present application.

A display device includes: a display panel including a pad portion disposed at a non-display area; and a flexible printed circuit board including a contact portion which contacts the pad portion. The flexible printed circuit board includes a scale pattern spaced apart from the contact portion. The scale pattern includes a plurality of scales arranged at a constant interval in a direction parallel to an extending direction of the contact portion. An end portion of the scale pattern is aligned with an end portion of the contact portion on an imaginary line.