The present invention discloses an alignment mark, a circuit board and a display device, the alignment mark is configured to position a to-be-bonded component during a bonding process and is constituted by first gold fingers provided in a bonding area of the to-be-bonded component. The alignment mark provided by the present invention is arranged in the bonding area and does not additionally occupy an effective area of the circuit board, which allows the circuit board to accommodate more components, thereby improving utilization ratio of the circuit board and meeting the need of narrow edge for the circuit board.

An inkjet printing system and method for processing wafers in a high volume are disclosed. The inkjet printing system includes a chuck on which a wafer can be placed and an inkjet printing head with at least one nozzle. Each chuck is associated with a single camera. Each chuck includes a 2-dimensional visual reference. An electronic controller assembly is configured to take a single image containing the wafer edge and the 2-dimensional visual reference each instance a wafer has been placed on a chuck. For each image, the position of the chuck relative to the camera and the position of the wafer relative to the camera are determined. Subsequently, the wafer position relative to the chuck is calculated and based on that the firing of the at least one nozzle is timed and the movement of the printing motion assembly is controlled so that the liquid drops are accurately positioned on the wafer.

The disclosure discloses a display panel, a detection method thereof, a flexible printed circuit, and a display device. The flexible printed circuit includes a second bonding area, a plurality of contact pins and at least one test pin group are arranged in the second bonding area; the contact pins are configured to be bonded respectively with corresponding contact pads in the first bonding area; the test pin group is configured to be bonded with a corresponding test pad group in the first bonding area; the test pin group includes test pins; and the test pin group is configured so that after bonding, bonding states of the contact pins with the contact pads are determined by detecting conducting or non-conducting state between the test pins and the corresponding test pads.

Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

The method for manufacturing a printed circuit board element (10) having an inlay (16) and a current sensor (30) for determining a current flowing in the inlay (16), wherein, for the improvement of the positional accuracy of the inlay (16) relative to the current sensor (30), the method comprises the following steps: providing a layer (12) of printed circuit board material having a recess (14), providing an inlay (16) having an inlay outline, inserting the inlay (16) in the recess (14); embedding the inlay (16) in the recess (14); completing and laminating the layered printed circuit board structure; applying at least two alignment markings (M1, M2) on an uppermost printed circuit board layer (AL); forming a defined cross-section tapering (S) on the inlay outline, the tapering being aligned with the at least two alignment markings (M1, M2); applying an assembly marking for a current sensor (30) on an uppermost printed circuit board layer (AL), the assembly marking being aligned with the at least two alignment markings (M1, M2).

A method for mounting a printed circuit board for an automotive vehicle on a carrier structure including at least one rivet. The printed circuit board includes at least one mounting aperture that is capable of accommodating the rivet and which defines an electrical conduction zone and at least one mark having a control end up to which the mark extends over the electrical conduction zone. The method includes a step of positioning the printed circuit board on the carrier structure such that the rivet extends through the mounting aperture, a step of riveting the rivet such that its head is at least partly flattened on the electrical conduction zone and a step of determining the conformity of riveting when the head of the rivet covers the control end of the mark.

A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.

In a mounting system including multiple mounting machines, there is provided a mounting system that is capable of reducing the number of measurement devices that measure electrical characteristics of an electronic component. A control device controls a switching device in order to connect a measurement device and a mounting machine that transmitted request information for measuring the electrical characteristics of the electronic component. When transmitting an instruction for starting measurement to the measurement device and receiving a characteristic measurement value from the measurement device, the control device transfers the received characteristic measurement value to the mounting machine that transmitted request information.

A glass panel for a wiring board, includes a first surface and a second surface, the second surface being opposite to the first surface; and an alignment mark constituted by a plurality of through holes each penetrating the glass panel from the first surface to the second surface, at least one of the plurality of through holes being configured such that a first diameter t1 of a first opening at the first surface, a second diameter t2 of a second opening at the second surface, and a minimum diameter t3 between the first surface and the second surface satisfy t1>t3 and also t2>t3.

A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.