Provided is a method for masking a sensitive signal by injecting noise into planes of a printed circuit board (PCB). The method comprises detecting, by a secondary integrated circuit (IC), a noise signal on a shared plane of a PCB that includes the secondary IC. The noise signal may be analyzed to determine the characteristics of the noise signal. A masking signal may be generated based on the characteristics. The masking signal may then be injected onto the shared plane.

In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

The present invention provides a printed circuit board assembly including a substrate having a plurality of conductive layers vertically sandwiched between a first cap-insulation layer and a second cap-insulation layer. The substrate has a first part, a second part and a third part. For protecting the conductive layers from moisture, each of the areas of the conductive layers corresponding to the second part is smaller than the area of the first cap-insulation layer corresponding to the second part for at least a first predetermined percentage, and each of the areas of the conductive layers corresponding to the second part is smaller than the area of the second cap-insulation layer corresponding to the second part for at least the first predetermined percentage.

An integrated circuit structure includes a substrate, a photosensitive molding on a first side of the substrate, a via formed in the molding, and a conformable metallic layer deposited over the first side of the substrate and in the via. A through via may be formed through the substrate aligned with the via in the molding with an electrically conductive liner deposited in the through via in electrical contact with the conformable metallic layer. The integrated circuit structure may further include a connector element such as a solder ball on an end of the through via on a second side of the substrate opposite the first side. The integrated circuit structure may further include a die on the first side of the substrate in electrical contact with another through via or with a redistribution layer.

Systems and techniques are provided for a co-located NFC reader. A top conductive layer may include an inner PCB section, including a circuit for an electronic device, and an outer PCB section, including a near-field communications (NFC) chipset, separated by a gap in which an NFC antenna connected to the NFC chipset may be located. A substrate layer may include an inner PCB section and an outer PCB section separated by the gap. A bridge including a trace may cross the gap. A lower conductive layer may include an inner PCB section, including a circuit for the electronic device electrically connected to the circuit for the electronic device located on the inner PCB section of the top conductive layer, and an outer PCB section, including a circuit for the electronic device, separated by the gap.

A wiring board according to one embodiment of the present disclosure includes: partitions each having insulating property; and conductive members that are respectively disposed in at least two adjacent regions among a plurality of regions partitioned by the partitions. Two of the conductive members respectively disposed in the adjacent regions are joined to each other through an opening formed on one of the partitions interposed between the two of the conductive members, to serve as part of a wiring.

An electronic control unit is configured to operate an electric motor from a rechargeable battery pack. The control unit has a circuit board with electronic components for driving the electric motor. Furthermore, an electrical braking circuit having a braking resistor and also a braking switch is provided. The receiving surface of the circuit board is spatially divided into a first surface region and a second surface region. The first surface region serves to receive electronic components; the second surface region serves to receive the braking resistor, wherein the braking resistor is configured as a conductor track which is formed on the circuit board.

An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

In some embodiments, an apparatus can include a printed circuit board (PCB) that has layers and includes a first portion and a second portion. The first portion can have a data port and a power port. A first layer is associated with data of the first portion of the PCB, and a second layer is associated with power of the first portion of the PCB. The second portion can have a data port and a power port. A third layer is associated with data of the second portion, and a fourth layer is associated with power of the second portion. The first portion or the second portion can have vias defining an electromagnetic interference (EMI) shield. The apparatus can include a power filter and a data filter that can, respectively, isolate power and data of the first portion from the second portion.

The present application provides a method of bonding an integrated circuit chip to a display panel. The method includes forming a plurality of first bonding pads in a bonding region on a first side of the display panel; forming a plurality of vias extending through the display panel in the bonding region; subsequent to forming the plurality of vias, disposing an integrated circuit chip having a plurality of second bonding pads on a second side of the display panel substantially opposite to the first side, the plurality of second bonding pads being on a side of the integrated circuit chip proximal to the display panel; and electrically connecting the plurality of first bonding pads respectively with the plurality of second bonding pads by forming a plurality of connectors respectively in the plurality of vias.