An electronic assembly includes a printed-circuit-board, an electronic-component, and a heat-sink-element. The printed-circuit-board has a first-surface and a second-surface opposite said first surface. The printed-circuit-board defines a via that connects the first-surface to the second-surface. The electronic-component defines a top-surface and a mounting-surface. The mounting-surface is in direct-contact with the printed-circuit-board. The heat-sink-element is in compressive-contact with both the electronic-component and the printed-circuit-board. The heat-sink-element defines a fin, a shank, and a contact-section therebetween. The contact-section rests on the top-surface, the fin extends above the top-surface, and the shank extends through the via of the printed-circuit-board and beyond the second-surface. The heat-sink-element is configured to transfer heat from the contact-section to the fin and the shank.

A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board includes: a core layer having a cavity provided therein; an electronic component included in the cavity; a conductive partition disposed on a side of the cavity; and insulating layers disposed on and below the core layer.

A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises: a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The hole extends beyond the first wall away from the second wall.

In some aspects, the techniques described herein relate to an apparatus including: a printed circuit board connector structure, comprising: an outer ground defining a receiving area; and a pair of traces located in the receiving area, the pair of traces collectively having a first side, a second side, a third side, and a fourth side, wherein the outer ground extends around each of the first side, the second side, and the third side of the pair of traces.

An intrinsically safe mobile device having a form factor, speed, and functionality comparable to a conventional non-intrinsically safe mobile device, includes non-intrinsically safe electronic components mounted on an unprotected part of a printed circuit board (PCB) contained within the mobile device, the non-intrinsically safe electronic components are encapsulated to reduce risk of sparking and to minimize surface heating to enable the encapsulated electronic components to be certified as intrinsically safe, wherein the encapsulated electronic components are connected using a trace with intrinsically safe electronic components mounted on a protected part of the PCB and are connected with user interface components using FPC cabling, wherein the trace and the FPC cabling are certified as intrinsically safe using one or more protection techniques chosen from a resistor, a double MOSFET clamping circuit, a capacitor, a fuse, and maintaining a minimum clearance space.

A package for an optical module includes a substrate provided through a side wall in a first direction. The substrate includes a first wiring layer including a first signal terminal, a second signal terminal, and a first ground terminal. The package includes a second wiring layer disposed under the first wiring layer. The second wiring layer includes a first ground pattern and a first insulating layer disposed between the first wiring layer and the second wiring layer, and includes a groove extending along the first direction, the groove being filled with a metal. The groove is provided within the first ground terminal, in a plan view, and the first insulating layer is free of the groove. The first ground terminal is electrically coupled to the first ground pattern through the metal of the groove.

A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises first and second coupling structures. Each coupling structure has a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The first and second coupling structures are symmetrically arranged with the first electrically conductive layers closer to each other than the second electrically conductive layers are to each other.