The present disclosure relates to a printed circuit board and a manufacturing method of the printed circuit board. The printed circuit board includes: a first insulating layer including a groove portion on an upper side; and a first wiring layer having an embedded portion embedded in the groove portion and a protruding portion protruding onto the first insulating layer. The protruding portion of the first wiring layer has a width of a lower end portion, narrower than a width of an upper end portion.

The present invention relates to layer manufacturing, more particularly to a method for additive layer manufacturing of objects comprised of more than one material with free-form capability for all included materials. The invention can for example be used for producing packaging for Microsystems where the ceramic acts as an insulator and the secondary material is used to produce electrical or optical 3D conductor lines or electrical or optical 3D vias. The fine powder used in this method enables it to be used for building components with small feature size and demand for high precision. Other intended uses for this method is to build small mechanical precision parts or grinding tools, dental objects or medical implants.

A wiring substrate includes a first conductor layer, an insulating layer covering the first conductor layer, a second conductor layer formed on a surface of the insulating layer, and a via conductor formed in a hole penetrating through the insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The insulating layer is formed such that the hole includes a first portion decreasing in width on the first conductor layer side, a second portion formed on the first conductor layer side of the first portion and increasing in width on the first conductor layer side, and a third portion formed on the first conductor layer side of the second portion and decreasing in width on the first conductor layer side.

The present disclosure relates to a printed circuit board including: a glass layer; a cavity penetrating between an upper surface and a lower surface of the glass layer; a metal layer disposed on a wall surface of the cavity; and an electronic component at least partially disposed in the cavity and spaced apart from the metal layer, and an upper surface of the metal layer is disposed on substantially the same level as the upper surface of the glass layer, or is disposed below the upper surface of the glass layer, and a lower surface of the metal layer is disposed on substantially the same level as the lower surface of the glass layer, or is disposed above the lower surface of the glass layer.