A component carrier including: i) a stack with at least one electrically insulating layer structure and at least one electrically conductive layer structure; ii) a first metal trace comprising a rough surface; and iii) a second metal trace arranged adjacent to the first metal trace, comprising a smooth surface. The component carrier is configured to guide high-frequency and or high-speed signals through the second metal trace.

A printed circuit board assembly (PCBA) waveguide assembly comprises a PCBA, a waveguide, and a spring-loaded rivet. The spring-loaded rivet comprises a rivet head, a rivet shank, a rivet tail, and a spring element and fastens the PBCA to the waveguide. The spring element provides flexibility in the clamping force of the rivet to accommodate thermal expansion and contraction, creeping and shear forces experienced by the PCBA and waveguide.

A flexible printed circuit board with embedded optical waveguide structure, including a photoelectric transmission unit, wherein the photoelectric transmission unit includes a flexible insulation layer, a first optoelectronic unit and a second optoelectronic unit embedded in the photoelectric transmission unit, at least one redistribution layer having at least one conductive structure stacked with the flexible insulation layer and electrically connected with the first optoelectronic unit and second optoelectronic unit, an optical waveguide structure stacked with the flexible insulation layer, a first metal bump and a second metal bump adjacent to the optical waveguide structure and in optical alignment respectively with the first optoelectronic unit and the second optoelectronic unit to provide reflection planes for optical signal, wherein first metal bump and second metal bump are solid structures made of the same material as the one of redistribution layer.

A compact integrated circuit (IC) that outputs millimeter-wave energy can be assembled into a highly compact package that can utilize ultrasmall contacts and/or contacts arrange with nonstandard pitch. The millimeter-wave IC can be assembled onto an interposer that includes an integrated transition configured to be coupled to a millimeter-wave waveguide on a printed circuit board having contacts that have a standardized size and pitch.

A wiring board has a built-in post wall waveguide having a region surrounded by two mutually opposing conductors and first and second post walls connecting the two conductors and serving as a transmission path for electromagnetic waves. The conductors oppose each other with insulating layers interposed therebetween. The first post wall has first columnar portions, formed by a laminate of via interconnects penetrating the insulating layers, arranged at predetermined intervals in a first direction in which the electromagnetic waves are transmitted. The second post wall has second columnar portions similar to the first columnar portions. In a cross sectional view taken in a second direction perpendicular to the first direction, an interval between adjacent via interconnects in one of the insulating layers not in contact with the conductor is wider than an interval between adjacent via interconnects in two of the insulating layers in contact with the two conductors, respectively.

A printed circuit board that includes a core substrate including a core layer, an upper glass layer on a surface of the core layer, and a lower glass layer on another surface of the core layer; an optical waveguide including at least a portion between the upper glass layer and the lower glass layer, the optical waveguide including a reflection layer on at least a portion of an inner wall of the optical waveguide; a first pad on the core substrate, the first pad being connected to the optical waveguide; a second pad on the core substrate, the second pad being spaced apart from the first pad, and the second pad being connected to the optical waveguide; and a heat emission layer contacting at least a portion of each of the first pad and the second pad.

A semiconductor package includes an optical printed circuit board (PCB) and an integrated circuit device on the optical PCB. The optical PCB includes a base layer, at least one photoimageable dielectric (PID) layer on the base layer, a horizontal optical waveguide extending in a horizontal direction in the at least one PID layer, a first via optical waveguide on a first side of the horizontal optical waveguide, in optical communication with the horizontal optical waveguide, and extending perpendicular to the at least one PID layer, and a second via optical waveguide on a second side of the horizontal optical waveguide, in optical communication with the horizontal optical waveguide, and extending perpendicular to the at least one PID layer.