An information processing apparatus includes a card slot; a circuit board; a flat card connector mounted on a main face of the circuit board; a first contact provided on the main face of the circuit board; a cover covering the card connector and the first contact on the circuit board; a second contact provided on a bottom face of the cover and contacting the first contact; a tampering detection wiring for tampering detection arranged on the cover and connected to the second contact; and an opening formed at a front end of the cover lager than an opening of the card slot. The cover is shaped so that a height from the circuit board to an area with the second contact on the bottom face of the cover is lower than a height from the circuit board to a top face of the card connector.

An electronics unit includes a housing, the housing having a base portion with a post member extending from the base portion. The post member has a through-hole defined through the post member. A printed circuit board is connected to the housing at a plurality of connection points. The printed circuit board includes one or more electric or electronic components disposed thereon and has an aperture. The post member is disposed through the aperture of the printed circuit board. A distal end portion of the post member is larger than a diameter of the aperture so as to fix the printed circuit board to the housing, forming one of the connection points.

An embodiment includes eyewear having an optical element, electronic components, a support structure configured to support the optical element and the electronic components, and light emitting diodes (LEDs) coupled to the electronic components and supported by the support structure. The LEDs are positioned to illuminate the support structure according to a lighting scheme.

In view of the existing problems affecting computer performance due to poor CPU cooling, this disclosure provides a motherboard arrangement method for improving the performance of the computer and a motherboard thereof, CPU being arranged on the back side of the circuit board, memory slots, expansion slots, peripheral interfaces and other components being arranged on the front side of the circuit board. The heat generated by CPU is directly transferred into a space between the back side of the motherboard and the corresponding side of the case through the cooling fan, the effective cooling and insulation space is formed in the case. It is easy for air circulation, to exhaust hot air outside the case by the power fan, and to make the cold air outside the case inside to improve the cooling efficiency greatly.

An electronic display where various electrical components may be removed from a housing of the display and serviced or replaced without having to demount the display. The electronic display may include an electronic image-producing assembly in electrical communication with a backplane. Various electrical components (e.g., electronic assemblies) may be removably connected to the backplane using self-guiding electrical connectors. An access opening through a wall of the housing may be provided to facilitate removal of an electrical assembly through the housing while the display remains mounted to a vertical surface.

Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.

Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.

A substrate for a tamper sensor includes a plurality of walls and a tab. The walls define a protective volume with an open side. The walls have a plurality of open edges adjacent the open side and a plurality of interior edges different from the open edges. The tab extends from one of the interior edges of one of the walls and is disposed within the protective volume.

A component assembly that includes a connection between two components, in particular an electronic circuit board and a housing. The connection includes a pin-shaped connector via which the electronic circuit board is held on the housing, and the pin-shaped connector in a passage of the housing being connected to the housing via a housing caulking. The pin-shaped connector, in the area of the housing caulking, includes a recess that cooperates with the housing caulking in such a way that the pin-shaped connecting means is held in the passage.

An embodiment includes eyewear having an optical element, electronic components, a support structure configured to support the optical element and the electronic components, and light emitting diodes (LEDs) coupled to the electronic components and supported by the support structure. The LEDs are positioned to illuminate the support structure according to a lighting scheme.