The invention relates to the field of techniques for manufacturing electronic devices having surface-mounted components, and can be used in avionics, telecommunication, lighting technology, and other fields, and can be configured as a power source, a converter, sensors, etc. The technical result consists in improved weight and dimension characteristics, improved heat dispersion, and increased electromagnetic screening. The present electronic module comprises a printed circuit board in the form of a three-dimensional structure, faces of which are formed by flat sections of the printed circuit board, and edges of which are formed by fold lines between the sections of the printed circuit board, wherein the mounting surface of the printed circuit board faces the inside of the three-dimensional structure, and electronic components and assemblies are grouped on the mounting surface of at least two sections of the printed circuit board such that the electronic components and assemblies of one section are disposed in the empty space between the components and assemblies of another section of the printed circuit board.

A bearing structure for a high-low-voltage conversion circuit is disclosed and includes an insulation carrier, a first conductor layer, a second conductor layer, a first trench and a first insulation material. The first conductor layer and the second conductor layer are coated on the first surface and the second surface of the insulation carrier, respectively. A voltage difference is formed between the first conductor layer and the second conductor layer. The first trench is disposed on the first surface and surrounds an outer peripheral edge of the first conductor layer. The first conductor layer is extended from the first surface into the first trench, and the outer peripheral edge of the first conductor layer is located at a bottom of the first trench. The first insulation material covers the outer peripheral edge of the first conductor layer and is filled in the first trench.

An object of the present disclosure is to provide a technique with which it is possible to achieve a weight reduction in a circuit assembly that includes two semiconductor elements that constitute a bidirectional relay A circuit assembly includes: a first bus bar; a second bus bar; a first semiconductor element; a second semiconductor element; a power circuit portion that electrically connects a first power terminal of the first semiconductor element and a third power terminal of the second semiconductor element; and a control circuit portion for electrically connecting both a first signal terminal of the first semiconductor element and a second signal terminal of the second semiconductor element to a control apparatus. At least one of the power circuit portion and the control circuit portion includes a flexible conductive path.

In an embodiment, an electronic device may include a housing including a hinge module, a first housing, and second housing. The first and second housings are rotatably coupled to each other via the hinge module to be in a folded state or an unfolded state. The electronic device may further include a flexible display, at least one conductive pattern disposed in the first housing, at least one conductor disposed at a position in the second housing corresponding to the at least one conductive pattern such that the at least one conductor is capacitively coupled to the conductive pattern when the electronic device is in the folded state, and a wireless communication circuit electrically connected to the at least one conductive pattern in the first housing. Other embodiments are also possible.

A photoelectric pulse sensor includes a light emitting device and a light receiving device disposed on a main surface of a circuit board with a predetermined distance apart from each other. A housing is provided to which the circuit board is attached and including a pair of openings respectively corresponding to the light emitting and receiving devices, with the housing including a light shield disposed at least between the pair of openings. The light shield includes a light shield member that is disposed on a surface of the housing facing the circuit board. The light shield member has a light shielding characteristics and flexibility. The light shield member is deformed by coming into contact with the circuit board when the circuit board is attached to the housing.

Disclosed is an electronic device that includes a first cover, a second cover opposite the first cover, a side housing disposed between the first cover and the second cover and including a plate disposed between the first cover and the second cover and a frame surrounding the plate and connected with the first cover and the second cover, a display disposed between the plate and the first cover, and a printed circuit board disposed between the plate and the second cover and including a first surface facing the plate, a second surface facing the second cover, and side surfaces provided between the first surface and the second surface, at least some of the side surfaces including plated areas. The plate includes a connection structure to which the printed circuit board is electrically connected, the connection structure includes a recess, the recess including a first sidewall, a second sidewall facing the first sidewall, a first conductive structure comprising a conductive material disposed on the first sidewall, and a second conductive structure comprising a conductive material disposed on the second sidewall, and at least part of the printed circuit board is disposed in the recess such that the plated areas contact the first conductive structure and the second conductive structure.

An embodiment includes eyewear having an optical element, electronic components, a support structure configured to support the optical element and the electronic components, and light emitting diodes (LEDs) coupled to the electronic components and supported by the support structure. The LEDs are positioned to illuminate the support structure according to a lighting scheme.

In an embodiment, an electronic device may include a housing including a hinge module, a first housing, and second housing. The first and second housings are rotatably coupled to each other via the hinge module to be in a folded state or an unfolded state. The electronic device may further include a flexible display, at least one conductive pattern disposed in the first housing, at least one conductor disposed at a position in the second housing corresponding to the at least one conductive pattern such that the at least one conductor is capacitively coupled to the conductive pattern when the electronic device is in the folded state, and a wireless communication circuit electrically connected to the at least one conductive pattern in the first housing. Other embodiments are also possible.

An electronic device may include a chassis. The electronic device may include a first electronic component that may include a first substrate and a first interconnect. The electronic device may include a second electronic component that may include a second substrate and a second interconnect. The second substrate may be physically separated from the first substrate. An electrical trace may be coupled to the chassis of the electronic device. The electrical trace may be sized and shaped to interface with the first interconnect of the first electronic component. The electrical trace may be sized and shaped to interface with the second interconnect of the second electronic component. The first electronic component and the second electronic component may be in electrical communication through the electrical trace coupled to the chassis of the electronic device.

A battery module which uses a flexible printed circuit board (FPCB) to provide a transmission path of information on the voltage or temperature thereof sensed by a bus bar. The battery module may have a smaller size in a height direction compared to a case of using a rigid printed circuit board (RPCB) or a wire instead of the FPCB to provide the transmission path of the information on the voltage or temperature, and may thus have improved energy efficiency per volume.