The present disclosure provides a power converter including a first capacitor, a second capacitor, and a power module. The first capacitor and the second capacitor are connected in series. The power module is electrically connected to the first capacitor and the second capacitor and includes a circuit board, an absorption capacitor, a primary switch circuit, a magnetic component, and a secondary circuit. The absorption capacitor, the primary switch circuit, the magnetic component and the secondary circuit are disposed on the circuit board. A primary winding and a secondary winding of the magnetic component are electrically connected to the primary switch circuit and the secondary circuit respectively.

Electrical components may have plastic packages. Contacts may be formed on exterior surfaces of the plastic packages. A plastic package for an electrical component may have an elongated shape that extends along a longitudinal axis. A first groove may run parallel to the longitudinal axis on a lower surface of the plastic package. A second groove may run perpendicular to the first groove on an opposing upper surface of the plastic package. The electrical components may be coupled to fibers in a fabric such as a woven fabric. A first solder connection may be formed between the first groove and a first fiber such as a weft fiber. A second solder connection may be formed between the second groove and a second fiber such as a warp fiber.

A power conversion device includes a first electrical component, a second electrical component, a housing, a board, and a guide part. The first and second electrical components are accommodated in and fixed to the housing. The board has first through holes into which first signal terminals of the first electrical components are inserted, and second through holes into which second signal terminals of the second electrical components are inserted. The guide part is connected to the board so that guide holes formed therein are aligned with the second through holes. The first signal terminals are connected to the board through a first connection portion, and the second signal terminals are connected to the board through a second connection portion. A number of the first through holes disposed per unit area is greater than a number of second through holes disposed per unit area.

Impedance assembly (120) for use in a voltage divider for sensing an AC elevated voltage of at least 1 kV of a power-carrying conductor (10) distributing electrical energy in a national grid. The impedance assembly comprises a) a PCB (170); b) a high-voltage contact (80) for connection to the power-carrying conductor; c) a first plurality of impedance elements (70) on the PCB, connected to the high-voltage contact and in series with each other such as to be operable in a first voltage divider (20) for sensing the voltage of the power-carrying conductor; and d) a second plurality of impedance elements (71) on the PCB, connected to the high-voltage contact and in series with each other such as to be operable in a second voltage divider (21) for harvesting electrical energy from the power-carrying conductor.

A first conductive pattern (13) is provided on an upper surface of the submount (7). A GND pattern (9) is provided on a lower surface of the submount (7). A lower surface electrode (21) of a capacitor (3) is bonded to the first conductive pattern (13) with solder (22). An upper surface electrode (23) of the capacitor (3) is connected to a light emitting device (2). A terminating resistor (4) is connected to the first conductive pattern (13). The first conductive pattern (13) has a protruding portion (25) which protrudes outside from the capacitor (3) in planar view. A width of the protruding portion (25) is narrower than a width of the capacitor (3).

A wiring board includes a substrate and a plurality of monolithic ceramic capacitors connected in series on the substrate. The plurality of monolithic ceramic capacitors includes a first monolithic ceramic capacitor oriented in a first direction and a second monolithic ceramic capacitor oriented in a second direction. The second direction is at an angle of 45±5 degrees relative to the first direction.

A storage device according to an embodiment includes a housing, a first board, a memory, and a capacitor. The first board is housed in the housing. The memory is mounted on the first board. The capacitor is in contact with one of the housing and a second board. The capacitor is electrically connected to the first board. The second board is housed in the housing.

A high-resolution substrate having an area of at least 100 square centimeters and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components, thereby creating a circuit assembly. Each independently operable cluster of components preferably includes a power distribution chip, a test/monitor chip, and at least one redundant chip for each type of logic device and for each type of memory device. The components in at least one of the independently operable clusters of components may include the components provided in a commercially available chiplet assembly. An electronic system may comprise multiple substrates comprising independently operable clusters of components, plus a motherboard, a system controller, and a system input/output connector.

A surface mountable laser driver circuit package is configured to mount on a host printed circuit board (PCB). A surface mount circuit package includes a lead-frame. A plurality of laser driver circuit components is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.

Power line patterns are, together with a ground pattern, provided separately from control line patterns. The power line pattern is formed at first and second major surfaces of a circuit board. When the circuit board is viewed in plan view, the power line pattern and the power line pattern form a line structure in which the power line pattern and the power line pattern are in parallel with and opposite to each other and the power line pattern is positioned under the power line pattern. The circuit board includes a dielectric between the power line pattern and the power line pattern. These together form an equivalent capacitor and the magnetic flux induced by the current flowing through the power line pattern and the magnetic flux induced by the current flowing through the power line pattern cancel each other out.