An interposer assembly comprising:an interposer configured to connect a first circuit substrate and a second circuit substrate disposed facing the first circuit substrate with each other; and a penetrating member that extends through the interposer from a position on one side of the interposer to a position on the other side of the interposer, wherein the penetrating member has at least one of thermal conductivity and electrical conductivity.

A substrate of an electronic device includes a first set of contact pads and a first set of contact pillars having a height greater than the first set of contact pads. Components are coupled to the first set of contact pads and the first set of contact pillars in traversing directions. The components coupled to the contact pillars are positioned above the components coupled to the first set of contact pads such that at least a first portion of a first side of the component coupled to the contact traces faces a first side of the components coupled to the contact pillars. Stacking passive components in this manner can allow for increased component density without increasing package size.

A power supply unit for an aerosol inhaler includes: a case; a power supply that discharges power to a load for generating an aerosol from an aerosol generation source; a discharging terminal that connects the load to the power supply; a charging terminal that connects the power supply to an external power supply and is separated from the discharging terminal; a temperature measuring unit that measures temperature of the power supply; and a control device that controls an effective value of a first charging current to a value smaller than an effective value of a second charging current. The first charging current is supplied to the power supply when a measurement value of the temperature measuring unit is equal to or higher than a first threshold and the second charging current is supplied to the power supply when the measurement value is lower than the first threshold.

A relay abnormality diagnosis system and method capable of diagnosing an abnormality of a relay by directly connecting a diagnosis resistor to a current measurement unit and by using a current input to the current measurement unit from the diagnosis resistor and a current flowing on an electric circuit measured by the current measurement unit, in the relay abnormality diagnosis system that diagnoses the abnormality of the relay using the diagnosis resistor.

A module type sensor includes a casing including a casing upper surface, a first casing side surface which is bent downward from the casing upper surface and has a lower end upwardly separated from a path through which a transmission line passes, and a second casing side surface which is bent downward from the casing upper surface and has a fixing bracket extending by being outwardly bent; a body unit fixedly installed inside the casing, formed of an insulator, supported by the printed circuit board at a lower end, and having, at a center, an opening which is open toward the transmission line; and a sensing substrate unit fixedly installed on an upper portion of the body unit, and including a voltage sensing circuit which is capacitively coupled to the transmission line exposed through the opening and a current sensing circuit which is inductively coupled to the transmission line.

Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

A copper base substrate of the present invention, in which a copper substrate, an insulating layer, and a circuit layer, are laminated in an order in the copper substrate, a ratio of a thickness (unit: .Math.m) to an elastic modulus (unit: GPa) at 100° C. is 50 or more in the insulating layer, and the circuit layer has an elastic modulus at 100° C. of 100 GPa or less.

A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

The invention relates to a method for manufacturing a component (1) comprising a printed circuit board (2) and a number of electrical components (3) arranged thereon. According to the invention, the electrical components (3) are pre-fixed on the printed circuit board (2), which is formed of plastic, by means of a fixing adhesive (9) and then completely encapsulated with an UV-adhesive (8).

A module includes: a substrate having an upper main surface and a lower main surface arranged in an up-down direction; a metal member provided on the upper main surface of the substrate, the metal member having a plate-shaped portion including a front main surface and a back main surface arranged in a front-back direction; a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member; a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member; and a sealing resin layer provided on the upper main surface of the substrate and covering the first electronic component, the second electronic component, and the metal member. The metal member includes an upper protruding portion extending on one side of the front-back direction from an upper end of the plate-shaped portion.