The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side

A device includes a printed circuit board assembly having a printed circuit board and one or more electronic components disposed on the printed circuit board, and a nanofilm disposed on the printed circuit board assembly. The nanofilm includes an inner coating in contact with the printed circuit board assembly, the inner coating including metal oxide nanoparticles having a particle diameter in a range of 5 nm to 100 nm; and an outer coating in contact with the inner coating, the outer coating including silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

A voltage divider circuit assembly includes resistors, an external electrostatic shield, and internal electrostatic shield(s). The resistors are in series with each other between input terminals that receive an input voltage. An external resistor is disposed between sensing terminals that conduct an output voltage that is the input voltage divided by the resistors in the series. The external shield is conductively coupled with the series of the resistors with the external resistor disposed outside of the external shield and the other resistor(s) inside the external shield. The internal shield(s) are conductively coupled with the resistors and disposed inside the external shield. A first internal resistor is disposed inside the external shield and outside of the internal shield(s). One or more remaining resistors are inside the internal shield(s). The shields divide parasitic capacitances to enable the measurement of dynamically changing high voltage input signals.

An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.

A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more upper notches extending downward from the upper side. The metal member further includes one or more foot portions extending forward or backward from the lower side.

An embodiment of the invention may include a method, and resulting structure, of forming a semiconductor structure. The method may include forming a component hole from a first surface to a second surface of a base layer. The method may include placing an electrical component in the component hole. The electrical component has a conductive structure on both ends of the electrical component. The electrical component is substantially parallel to the first surface. The method may include forming a laminate layer on the first surface of the base layer, the second surface of the base layer, and between the base layer and the electrical component. The method may include creating a pair of via holes, where the pair of holes align with the conductive structures on both ends of the electrical component. The method may include forming a conductive via in the pair of via holes.

A power supply unit includes: a power supply configured to discharge power to a load for generating an aerosol from an aerosol generation source; a charger configured to convert inputted power into charging power; a temperature measuring unit configured to measure a temperature of the power supply; and a charging controller configured to perform a first control for stopping the charger from supplying the charging power to the power supply and a second control for causing the charger to supply the charging power to the power supply, the charging controller setting a duty ratio to a value greater than 0 and smaller than 100 in a case where the temperature of the power supply is within a predetermined range, and the duty ratio being obtained by dividing a time during which the charging controller performs the first control by a unit time.

A pressure sensor and an electronic device are disclosed. The pressure sensor includes a flexible printed circuit board (110) and multiple pressure sensitive adhesive resistors. The multiple pressure sensitive adhesive resistors include pressure sensitive adhesive resistors R1, R2, R3, R4, R5, and R6. The flexible printed circuit board (110) includes a first surface (A) and a second surface (B) that are opposite each other. The pressure sensitive adhesive resistors R1, R3, and R5 are disposed on the first surface (A), and the pressure sensitive adhesive resistors R2, R4, and R6 are disposed on the second surface (B). The flexible printed circuit board (110) is provided with a through hole (C) that allows the first surface (A) to communicate with the second surface (B), and the through hole (C) is at least partially covered by the pressure sensitive adhesive resistors R1, R2, R3, and R4.

An embedded magnetic component transformer device includes primary, secondary, and auxiliary windings that are defined by conductive vias connected by conductive traces. The conductive traces and vias of the auxiliary winding are arranged between the conductive traces and vias of respective first and second portions of the primary winding, so that the auxiliary winding is provided substantially in the center of the width of the PCB. Power connections are provided at respective opposing edges of the device, and surface mounted transistors are provided close to the primary winding portions between the auxiliary winding and the edge of the device. The device provides an efficient utilization of the surface conductive traces such that large areas of the surface remain for other functions, such as ground plates. The thermal properties of the device are balanced by distributing the transistors and the power connections.

A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.