Described herein are apparatuses and methods for applying high voltage, sub-microsecond (e.g., nanosecond range) pulsed output to a biological material, e.g., tissues, cells, etc., using a high voltage (e.g., MOSFET) gate driver circuit having a high voltage isolation and a low inductance. In particular, described herein are multi-core pulse transformers comprising independent transformer cores arranged in parallel on opposite sides of a substrate. The transformer cores may have coaxial primary and secondary windings. Also describe are pulse generators including multi-core pulse transformers arranged in parallel (e.g., on opposite sides of a PCB) to reduce MOSFET driver gate inductance.

A printed circuit board (PCB) assembly is provided. The PCB assembly comprises a printed wiring board (PWB) and one or more electrical components mounted thereon. The PWB comprises a plurality of layers including conductive layers and insulative layers, where one or more of the insulative layers is a prepreg layer that is halogen-free; one or more slotted portions on a surface of the PWB, which are indented into the PWB; and one or more pads disposed on the surface of the PWB, which are paired with the one or more slotted portions. Each of the one or more electrical components is mounted on the surface of the PWB through a pair of a slotted portion and a pad.

A system including a point of load converter module (POL). The POL module includes a point of load printed circuit board. At least one inductor is mounted to the point of load printed circuit board. The POL module includes a power network. The point of load converter module is configured to be surface mounted. The system includes a heat sink including a first leg configured to be surface mounted adjacent the point of load printed circuit board, a second leg configured to be surface mounted adjacent the point of load printed circuit board opposite the first leg, and a cap portion connecting the first leg to the second leg. The heat sink is sized and shaped to encompass the POL and configured to connect to the power network. The power network may be a PGND network.

A high voltage inductive adder is disclosed. An inductive adder may include a plurality of switch boards that each include a plurality of switch boards that include a plurality of solid state switches. These switch boards may be stacked one upon another. The inductive adder may include a transformer comprising a plurality of toroid-shaped transformer cores disposed on a corresponding one of the plurality of switch boards; and a transformer rod that extends through the plurality of switch boards and the plurality of transformer cores. The inductive adder may include an output electrically coupled with the transformer rod. And each of the plurality of circuit boards, for example, may include a tailbiter circuit electrically coupled in parallel with the output.

An embedded package structure includes an insulation substrate, a first conductive layer, a second conductive layer, an electronic component and a passive component. The insulation substrate has a first conductive via and a second conductive via. The first conductive layer is formed on a top surface of the insulation substrate and contacted with the first conductive via. The second conductive layer is formed on a bottom surface of the insulation substrate, and contacted with the second conductive via. The electronic component is embedded within the insulation substrate. Moreover, plural conducting terminals of the electronic components are electrically connected with the first conductive layer and the second conductive layer through the first conductive via and the second conductive via. The passive component is located near a first side of the electronic component and separated from the electronic component. The passive component is at least partially embedded within the insulation substrate.

Disclosed is a hearing device configured to be worn in an ear of a user. The hearing device is configured to provide an audio signal to the user. The hearing device comprises a circuit assembly. The circuit assembly comprises a printed circuit board assembly. The printed circuit board assembly comprises: a first circuit board; a second circuit board; a third circuit board interconnected with the first circuit board and the second circuit board; and a fourth circuit board. The circuit assembly comprises a battery, wherein the printed circuit board assembly is folded about the battery.

Disclosed herein is an electronic circuit module that includes a circuit board and a common mode filter mounted on the circuit board. The common mode filter includes first and second terminal electrodes constituting a first pair of terminal electrodes and third and fourth electrodes constituting a second pair of terminal electrodes. The circuit board includes: a first wiring layer having first, second, third, and fourth land patterns connected to the first, second, third, and fourth terminal electrodes, respectively, and first, second, third, and fourth wiring patterns connected to the first, second, third, and fourth land patterns, respectively; and a second wiring layer having a ground pattern that overlaps the first, second, third, and fourth wiring patterns without overlapping the first and second land patterns.

A power module and a power device having the power module are disclosed. The power device includes a main board. The power module is inserted in the main board and includes a PCB, a magnetic element, a primary winding circuit and at least one secondary winding circuit. The magnetic element is provided on the PCB and includes a core structure, a primary winding and at least one secondary winding. The core structure has a first side and a second side opposite to each other, and a third side and a fourth side opposite to each other. The primary winding circuit is provided on the PCB and positioned in the vicinity of the first or second side of the core structure. The secondary winding circuit is provided on the PCB and positioned in the vicinity of the third or fourth side of the core structure.

A magnetic device comprising a magnetic body, a coil disposed in the magnetic body and at least one thermal conductive layer, wherein a first portion of the at least one thermal conductive layer encapsulates at least one portion of the coil and a second portion of the at least one thermal conductive layer is exposed from the magnetic body, wherein the at least one thermal conductive layer forms a continuous thermal conductive path from the coil to the outside of the magnetic body for dissipating heat generated from the coil.

An electromagnetic component for a circuit board includes first and second magnetic core pieces and a bifilar coil extending between the first and second magnetic core pieces. The bifilar coil includes a first coil segment having first and second surface mount terminations, and a second coil segment having third and fourth surface mount terminations. The bifilar coil and core pieces facilitate a significant height reduction in the component while offering the same performance as existing power inductor components.