A voltage regulator module includes a first circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board, a plurality of switch elements and a first molding compound layer. The switch elements are mounted on a first surface of the first printed circuit board. The first molding compound layer is formed on the first surface of the first printed circuit board to encapsulate the switch elements. The magnetic core assembly is arranged beside a second surface of the first printed circuit board, and includes a magnetic core portion and at least one first U-shaped copper structure. The magnetic core portion includes a plurality of openings. Each first U-shaped copper structure is penetrated through two corresponding openings to define two inductors. A first terminal of each inductor and the corresponding switch element are connected in series to define a phase circuit.

An integrated circuit (IC) device may include a first substrate having an inductor ground plane in a conductive layer of the first substrate. The integrated circuit may also include a first inductor in a passive device layer of a second substrate that is supported by the first substrate. A shape of the inductor ground plane may substantially correspond to a silhouette of the first inductor.

An electricity storage unit includes: an electricity storage device; a circuit portion on which an electronic component is mounted; a heat dissipation member that dissipates heat from the circuit portion; and a holding member that holds the electricity storage device in a state where the electricity storage device, the circuit portion, and the heat dissipation member are stacked, wherein the holding member is provided with a supporting portion that supports the electricity storage device and abuts against the heat dissipation member.

A component includes a magnetic core having a body formed of a first material, defining a first opening and a second opening thereon. A duct formed of a second material extends at least partially through the body between the first opening and the second opening. The first opening and the second opening are in fluid communication by way of the duct.

A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.

A method of making a component-on-package circuit may include attaching a component for an electrical circuit to a circuit module. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component after the attachment both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides a spring-like cushioning of force applied to the component in the direction of the circuit module. The circuit module may be encapsulated in molding material after the circuit module has been attached to the component, without encapsulation the component at the same time.

According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.

An inductor sensor assembly for determining to position of object includes a layer of ferrite overlaying exciting and receiving coils formed on a substrate. A magnet attached to the target produces a virtual coupler in an area of ferrite overlaying the coils. An application for a shock absorber includes a sensor module mounted in a recess in a dust cover and a magnet mounted to a cylinder tube of the shock absorber.

A filter inductor for high-current applications. The filter inductor includes a magnetic core and a winding. The winding includes a shaped section having opposing ends, a pair of arm sections laterally extending from the opposing ends of the shaped section, respectively, and a pair of inductor pins, each extending perpendicular from an end of a respective arm section. The magnetic core includes a first core portion and a second core portion. The first core portion includes a recessed channel configured to receive the shaped section of the winding. The second core portion includes a pair of recessed regions configured to receive the pair of arm sections of the winding, respectively. The first core portion and the second core portion are coupled in contact to one another to secure the shaped section of the winding within the magnetic core. The filter inductor can be edge-mounted to a printed circuit board.

An electronic device includes an exterior portion of a conductive material, a circuit portion including circuit elements, and a protection circuit portion connected between the exterior portion and the circuit portion. The protection circuit portion includes a switching unit to intercept leakage current that flows from the circuit portion and leaks to the exterior portion, and a conversion unit to reduce a voltage level of an electrostatic component that flows through the exterior portion and to transfer the electrostatic component to the switching unit.

The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.