A power supply circuit includes a printed circuit board (PCB), and a transformer coupled to the PCB. The power supply circuit also includes a first inductor assembly coupled to the PCB and electrically connected to the transformer, and a second inductor assembly coupled to the PCB and electrically connected to the transformer. The first inductor assembly has an inner edge and an opposite outer edge, and the second inductor assembly has an inner edge and an opposite outer edge. The inner edge of the second inductor assembly is spaced apart from the inner edge of the first inductor assembly by a gap. The power supply circuit also includes a first magnetic shunt coupled to the outer edge of the first inductor assembly, and a second magnetic shunt coupled to the outer edge of the second inductor assembly.

An electronic control unit includes a substrate, an electronic component, a heat sink, a cover, a heat accumulator, and a screw. A wiring pattern is formed on the substrate. The electronic component is mounted on the substrate and generates heat upon energization thereof. The heat sink is provided on one side of the substrate in its thickness direction. The cover is made of resin and is provided on the other side of the substrate in its thickness direction. The heat accumulator is fixed to a part of the cover on the substrate-side and is in contact with a surface of the substrate on the cover-side. One end of the screw is connected to the heat sink. A central portion of the screw is inserted through a hole passing through the substrate in its thickness direction. The other end of the screw is connected to the heat accumulator.

A magnetic device for an electronic circuit includes a printed circuit board. A first and second magnetic component assembly can be electrically connected to the printed circuit. The second magnetic component assembly can be stacked on the first magnetic component assembly. The first magnetic component assembly can be positioned between the second magnetic component assembly and the printed circuit board. Each magnetic component assembly can include a bobbin, a winding disposed on the bobbin, and a core extending through the bobbin. A second bobbin on the second magnetic component can be positioned on either a first core or a first bobbin of the first magnetic component assembly. The stacked magnetic component configuration can help reduce the board space required to electrically connect both the first and second magnetic component assemblies to the printed circuit board, which can help increase the power density of the magnetic device.

Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.

A high-frequency module includes a multilayer substrate that includes an insulator layer and a wiring electrode, a component on one main surface of the multilayer substrate, a resin layer on the one main surface so as to cover the component, and a shield electrode covering at least a portion of a surface of the resin layer and at least a portion of a side surface of the multilayer substrate. The wiring electrode includes a capacitor via electrode that is spaced away from the shield electrode inside the multilayer substrate, and a first capacitor is defined by the shield electrode and the capacitor via electrode.

Electronic parts for improving an isolation distance are provided. The electronic part includes: at least one plate; and first and second terminals each connected to the plate, wherein the electronic part is mounted in a PCB through the first and second terminals and a creepage distance between the first terminal and the second terminal is greater than a clearance distance between the first terminal and the second terminal.

A power supply module having two output voltages includes an inductor module and a main board. The inductor module includes a first magnetic core, a second magnetic core, an intermediate magnetic core disposed therebetween, a first winding and a second winding. The first winding is disposed on one of a magnetic column of the first magnetic core and a magnetic column of the intermediate magnetic core to form a first inductor. The second winding is disposed on one of a magnetic column of the second magnetic core and a magnetic column of the intermediate magnetic core to form a second inductor. There is no air gap at a portion of the intermediate magnetic core where magnetic paths of the first and second inductors pass through together. The inductor module is disposed on the main board. The first winding and the second winding are electrically connected with the main board.

An electronic component includes an inner electrode inside of a main body and exposed at a surface of the main body, and an outer electrode on a surface of the main body and electrically connected to the inner electrode, wherein a plurality of recesses are provided in a surface of the outer electrode, and each of the plurality of recesses includes a portion in which a diameter of an opening of the recess gradually decreases toward an opening side of the recess.

Provided is a printed circuit board including: an insulating layer; electronic devices embedded in the insulating layer; and an adhesive layer for fixing the electronic devices.

The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.