A magnetic base body comprises multiple metal magnetic grains and bonding parts for bonding the multiple metal magnetic grains, wherein the bonding parts are constituted by an amorphous mixture containing carbon and an oxide of at least one element selected from silicon, aluminum, chromium, magnesium, titanium, and zirconium. A coil component using the magnetic base body can improve mechanical strength while ensuring insulation reliability.

A high frequency amplifier includes an asymmetric Doherty amplifier configured to amplify a high frequency signal having a wavelength A, the high frequency signal being input, and the asymmetric Doherty amplifier including a carrier amplifier and a peak amplifier, the peak amplifier being configured to start an amplifying operation when an output of the carrier amplifier reaches a saturation region and having a saturation output different from a saturation output of the carrier amplifier, a driver amplifier configured to drive the asymmetric Doherty amplifier, a branch circuit configured to branch the high frequency signal amplified by the driver amplifier into an input path on a peak amplifier side and an input path on a carrier amplifier side, a phase adjustment circuit configured to delay either a phase of a signal input to the peak amplifier or a phase of a signal input to the carrier amplifier, the phase adjustment circuit being provided on either the input path on the peak amplifier side or the input path on the carrier amplifier, a first substrate on which the carrier amplifier and the peak amplifier are mounted, and a second substrate on which the driver amplifier, the branch circuit, and the phase adjustment circuit are mounted. An input terminal of the driver amplifier and an input terminal of the carrier amplifier are disposed at positions where the input terminal of the driver amplifier and the input terminal of the carrier amplifier project to each other when the second substrate is stacked on the first substrate. An electrical length from the input terminal of the driver amplifier to an output terminal of the carrier amplifier is set to a phase of (2n+1)×π, where n is an integer greater than or equal to 0.

A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.

A discrete electrical component is disclosed, including a component member having at least one lead; and a base member on which the component member is supported. The electrical component further includes at least one compliant pin member, each compliant pin member having a first end portion configured for press-fit engagement in a printed circuit board and a second end portion electrically connected to the at least one lead of the component member. The at least one compliant pin at least partly extends through or into the base member.

A multilayer coil component 1 includes an element body 2, a pair of terminal electrodes 3, and a glass layer G provided on the terminal electrode 3. Each of the pair of terminal electrodes 3 is provided with a plurality of first projecting portions 33 tapered toward the other facing terminal electrode 3 side in an end portion 31b facing the side in the facing direction of a pair of end surfaces 2a and 2b. The glass layer G is provided along the edge of the terminal electrode 3 including at least the first projecting portion 33 in the end portion 31b of the terminal electrode 3.

A magnetic device includes a first conductive structure, a second conductive structure and a magnetic core formed of a powder magnetic material. The first conductive structure includes a first connection part, a first conductive body and a second connection part. The first conductive body is connected between the first connection part and the second connection part. The second conductive structure includes a third connection part, a second conductive body and a fourth connection part. The powder magnetic material, the first conductive structure and the second conductive structure are laminated together. The first conductive structure and the second conductive structure are embedded in the magnetic core. The first connection part and the third connection part are exposed to the fifth surface. The second connection part and the fourth connection part are exposed to the sixth surface.

A power supply module having at least one inductor modules, a top PCB mounted on top of the at least one inductor modules, and at least one pair of power device chips mounted on top of the top PCB, wherein power pins and signal pins for connecting the top PCB and a board that the at least one inductor modules are attached to, are implemented by metal layers wrapping each of the at least one inductor modules.

This disclosure provides an integrated transformer and a power converter, the integrated transformer includes: a magnetic core, including an upper cover, a lower cover, a first winding column and a second winding column; a printed wiring board, disposed between the upper cover and the lower cover, and including a first through hole corresponding to the first winding column and a second through hole corresponding to the second winding column; and a first winding, a second winding, a third winding and a fourth winding; the first winding and the third winding are wound on the first winding column and the second winding column respectively, the second winding and the fourth winding are provided at positions corresponding to the first through hole and the second through hole on the printed wiring board, and magnetic flux directions within the first winding column and the second winding column are opposite.

An antenna substrate includes: a first substrate including an antenna pattern disposed on an upper surface of the first substrate; a second substrate having a first planar surface, an area of which is smaller than an area of a planar surface of the first substrate; and a flexible substrate connecting the first and second substrates to each other and bent to allow the first planar surface of the second substrate to face a side surface of the first substrate, which is perpendicular to the upper surface of the first substrate.

A display device includes a display panel including a first surface and a second surface opposite to the first surface, the second surface having a first area and a second area surrounding the first area, a conductive sheet disposed on the second surface of the display panel and including a first conductive line disposed in the first area and extending in a first direction and a conductive layer disposed in the second area, a first circuit board bending from the first surface to the second surface to be connected to a first end of the first conductive line, and a second circuit board spaced apart from the first circuit board in the first direction, the second circuit board bending from the first surface to the second surface to be connected to a second end opposite to the first end of the first conductive line.