A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

An irreversible power switch which is operational from the outside after lamination of laminated communication device and the like, includes a substrate, electrodes disposed on the substrate, a brittle member disposed so as to face the electrodes and apart from the electrodes and a conductive adhesive portion disposed on the brittle member at a side to face the electrodes thereof. The electrodes and the conductive adhesive portion are irreversibly and electrically bonded by brittle fracture of the brittle member under the external pressing force in the thickness direction of the laminated communication device.

The present disclosure provides a battery module comprising a circuit board, the circuit board comprises a conductive layer, a first pad and a second pad. The conductive layer is formed with a sampling circuit, the sampling circuit comprises: a sampling end portion; an outputting end portion; a first branch path formed with a first fusing zone; and a second branch path formed with a second fusing zone. The first pad is provided on the sampling end portion, the second pad is provided on the second branch path. When the first fusing zone is fused, the circuit board can be quickly repaired by means of the second branch path and the second pad to electrically connect the sampling end portion and the outputting end portion, thereby achieving the purpose of reusing the circuit board, therefore the entire battery module is not scrapped and the utilization of the battery module is improved.

A flexible circuit board comprises: a first dielectric which has a first signal line in contact with an upper surface or lower surface thereof, has a greater width than the first signal line, and extends along an extension direction of the first signal line; a second dielectric which is located below the first dielectric, has a second signal line in contact with the upper or lower surface thereof, has a greater width than the second signal line, and extends along an extension direction of the second signal line; a vertical section in which the first signal line and the second signal line are located on a same vertical line and the first signal line and the second signal line extend in parallel; and a horizontal section in which the position of the first signal line or the second signal line is changed through a via hole.

A luminous protective case for an electronic device includes a casing that matches dimensions of the electronic device, an electronic circuit board provided along an inner side of a grooved frame of the casing, a magnetic adapter provided on the electronic circuit board and insertable into a preset interface of the electronic device, a plurality of light-emitting sources distributed in and along the grooved frame of the casing, and a main control circuit that controls the light-emitting sources. A magnetic end of the magnetic adapter is exposed from the casing. The luminous protective case for an electronic device can obtain electricity from the electronic device, charge the electronic device, and display a dazzling lighting effect along a side frame of the protective case. This can greatly enhance a user's experience.

A system for incorporating electronic functionality into a flexible layer includes a flexible printed circuit board having a spine portion and one or more legs in electronic communication with the spine portion. Multiple pads may be disposed on the flexible printed circuit board. The spine portion and the one or more legs may be structured and arranged to be disposed within one or more pockets of the flexible layer. The system may further include electronic devices, each one of which may be in electronic communication with at least one of the pads. In addition, the system may include a controller in electronic communication with at least one of the pads. The system may be characterized by an absence of any external hard-wire interfaces for communication external to the system.

A sensor device in which flexibility is ensured over the entirety of the device and that can be manufactured at low costs is provided. The sensor device having flexibility includes a flexible substrate, a temperature/humidity sensor connected to the flexible substrate, and an exterior body formed of a soft material. The temperature/humidity sensor has a waterproof moisture-permeable material that covers a detection surface. The exterior body has an opening that exposes the waterproof moisture-permeable material. The flexible substrate is bonded at at least a peripheral part thereof to the exterior body.

A wiring module is to be attached to a battery cell stacked body in which a plurality of battery cells having an electrode terminal and being elongated in a front-rear direction are arranged in a horizontal direction, and is electrically connected to the battery cells, the wiring module including: a bus bar that is connected to the electrode lead; an FPC that is connected to the bus bar and extends in the front-rear direction; and a protector that holds the bus bar and the FPC, wherein the FPC includes: a plurality of extension parts that extend in the front-rear direction; an intersection part that extends in the horizontal direction; and a bending part, the extension parts are respectively coupled to two end portions of the intersection part in the horizontal direction, one of the extension parts includes the bending part in the vicinity of the intersection part.

A battery pack including a first printed circuit board, a second printed circuit board, and a PCB spacer, the PCB spacer including a housing and at least two board-to-board terminals, the PCB spacer housing injection molded around the board-to-board terminals, wherein the first printed circuit board coupled to a first side of the PCB spacer and the second printed circuit board coupled to a second side of the PCB spacer, the first side of the PCB spacer being opposed to the second side of the PCB spacer.

An apparatus for mounting on a circuit board is provided. The apparatus may include a circuit board mount packaging and a battery. The circuit board mount packaging may include a cavity, a first internal lead, and a second internal lead. The first internal lead may be connect to a first external pin and the second internal lead may be connected to a second external pin. The battery may be disposed within the cavity of the circuit board mount packaging. The battery may comprise an anode and a cathode. The anode may be wire bond connected to the first internal lead and the cathode may be wire bond connected to the second internal lead.