Patent classifications
H05K2201/10037
FLEXIBLE PRINTED CIRCUIT
A flexible printed circuit includes: a chip component serving as an electronic component having a first electrode and the like; a base film; a conductive first pattern layer which is laminated on a portion of the base film and has a bonding region to which the electrode is, for example, soldered; and a coverlay laminated on the base film or the first pattern layer via an adhesive and having an opening for externally exposing a portion of the first pattern layer including the bonding region, and the chip component. The first pattern layer has a groove that opens in a range between the bonding region and an edge of the opening on a surface of the first pattern layer.
CIRCUIT BOARD SOLDERING STRUCTURE
A circuit board soldering structure includes lead a plate inserted into a slit hole of a circuit board and soldered to a conductive pattern provided along the slit hole. The lead plate is made of an elastically-deformable metal plate thinner than an opening width (W) of slit hole. The lead plate includes insertion section inserted into the slit hole. The insertion section includes a bent section approaching from one of opposing inner surfaces of the slit hole facing each other toward another of the opposing inner surfaces of the slit hole. The bent section is disposed in the slit hole. The insertion section has both surfaces that are close to or contact corresponding opposing inner surfaces of the slit hole to solder the insertion section to the conductive pattern.
Serviceable flex circuit for battery module
A battery connector, including a flexible circuit including a first set of electrical circuitry connecting to a plurality of energy storage cells, where the first set of electrical circuitry terminates at a first connection point at the battery connector; a controller including components to control the energy storage cells connected to a second set of electrical circuitry terminating at a second connection point at the battery connector; where the first connection point and the second connection point are electrically connected.
ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC COMPONENT MOUNTED BODY, AND METHOD OF MANUFACTURING THE SAME, AS WELL AS ELECTRONIC APPARATUS
An electronic component mounted body includes a substrate, a connection section provided on the substrate, an electronic component having a terminal connected to the connection section, and a solder that fixes the electronic component to the connection section. The connection section has a first region in which the terminal is fixed through the solder, and a second region lower in wettability than the first region, and the second region has an extension region extended to a peripheral edge of the connection section, and a spaced region that projects from the extension region toward the first region and that is provided to be spaced from the peripheral edge.
FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING TERMINAL, AND POWER STORAGE MODULE
A flexible printed circuit board includes an electrically conductive line and a land that is connected to the electrically conductive line and to be connected to a terminal. The land includes soldering portions that have metal surfaces and to which the terminal is to be soldered. A dividing section is between the soldering portions and the dividing section has a non-metal surface and defines each of the soldering portions that are adjacent to each other.
FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING TERMINAL, WIRING MODULE, AND POWER STORAGE MODULE
A flexible printed circuit board including a terminal includes a flexible printed circuit board that includes an electrically conductive line and the terminal soldered to the flexible printed circuit board. The flexible printed circuit board includes a land and a soldering restricting section. The land is electrically connected to the electrically conductive line and has a metal surface and is soldered to the terminal. The soldering restricting section has a non-metal surface and is not soldered to the terminal. The terminal includes an overlapping section and a protrusion section. The overlapping section overlaps the land and is soldered to the land and includes a removed section that is formed in such a manner that a portion is partially removed in a predefined area. The protruding section is continuous from the overlapping section and protrudes to an area that does not overlap the flexible printed circuit board.
Battery pack protection circuit module
A secondary battery pack comprises a battery and a protection circuit module (PCM), a pair of electrodes of the battery being connected to a protection circuit board (PCB) forming part of the PCM such that the electrode connections are located on a face of the PCB other than a major face that receives PCM components thereon. In some embodiments, the PCM components are mounted on one of a pair of major faces of the PCB, the electrode connections being located on the opposite one of the major faces. In other embodiments, the electrode connections are located on a peripheral edge face that extends transversely between the pair of major outer faces of the PCB. The spatial arrangement of the electrode connections and the PCM components on the PCB is such that substantially the entirety of one major outer face of the PCB is available for the placement of PCM components.
Information handling system with high current battery planar tab interconnect
A battery cell includes a first power tab and a first conducting wire. The first power tab may include a proximal end connected to the battery cell, and may provide a first output terminal for the battery cell. The first conducting wire may be connected to a distal end of the first power tab, and may be encircled by the first power tab. The first conducting wire may connect with a power circuit board to provide power from the battery cell.
Electronic device using interposer in printed circuit board
An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.
Systems and methods for battery structure, interconnects, sensing, and balancing
Exemplary systems and methods enable efficient and reliable positioning, assembly, retention, interconnection, and management of battery cells in battery packs, for example battery packs utilized in electric vehicles.