Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a radio frequency (RF) die having a lateral surface area and a plurality of contacts on a face, where the RF die is embedded in the package substrate with the plurality of contacts facing towards the second surface of the package substrate, and an RF front end between the RF die and the first surface of the package substrate, where the RF front end is positioned under the RF die and does not extend beyond the lateral surface area of the RF die.

A multi-terminal capacitor is provided that can be used either as a feedthrough capacitor or as a LW reversal capacitor. A multi-terminal capacitor includes a capacitor body shaped like a rectangular parallelepiped. The capacitor body includes a capacitance forming portion configured to form capacitance between a first conductor film and a second conductor film facing each other with a dielectric film being interposed therebetween. On one of the surfaces of the capacitor body in the third direction, first and second external terminals electrically connected to the first conductor film, and a third external terminal electrically connected to the second conductor film are provided. On the other of the surfaces of the capacitor body in the third direction, fourth and fifth external terminals electrically connected to the first conductor film and a sixth external terminal electrically connected to the second conductor film are provided.

An integrated qubit readout circuit is presented, which includes a superconducting parametric amplifier, a circuit board arranged to mount the superconducting parametric amplifier, a circulator mounted on the circuit board and connected to the superconducting parametric amplifier, wherein the circulator comprises a termination port electrically connected to a termination resistor arranged to terminate a pump tone received by the superconducting parametric amplifier, and wherein the termination resistor is mounted on the circuit board.

A composite electronic component includes: a first electronic component including a ceramic body having a main surface caused to face a circuit board at a time of mounting and first and second end surfaces orthogonal to the main surface, and a first external electrode and a second external electrode respectively provided to the first end surface and the second end surface and respectively extending from the first end surface and the second end surface to the main surface; and a second electronic component including a functional film provided to the main surface, and a first electrode film and a second electrode film provided to both end portions of the functional film separately from the first external electrode and the second external electrode, the second electronic component being configured to fit within a thickness of each of the first external electrode and the second external electrode from the main surface.

A flexible circuit film includes the following elements: a base film; a first power input terminal, a second power input terminal, a first power output terminal, and a second power output terminal each disposed on the base film; an integrated circuit chip disposed between the first power input terminal and the first power output terminal and overlapping the base film; first power wiring disposed on the base film, connecting the first power input terminal to the first power output terminal, and including a first connection part; and second power wiring disposed on the base film, connecting the second power input terminal to the second power output terminal, and including a second connection part. The first connection part and the second connection part are disposed between the base film and the integrated circuit chip, overlap the integrated circuit chip, and are spaced from each other.

A network device having improved thermal cooling is provided. The network device comprising a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.

The present invention provides a printed circuit board comprising: a dielectric layer (130); N pairs of differential signal vias (2) which penetrate through the dielectric layer wherein N is an integer more than one; N pairs of first strip conductors (101,102) disposed on a first surface of the dielectric layer; a first ground conductor layer (103) disposed in the dielectric layer forming N first differential transmission lines (100) with the N pairs of first strip conductors and the dielectric layer; N pairs of second strip conductors (111,112) disposed on a second surface of the dielectric layer; a second ground conductor layer (113) disposed in the dielectric layer forming N of second differential transmission lines (110) with the N pairs of second strip conductors and the dielectric layer.

A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.

An electronic device includes a first circuit operating on a first signal of a first frequency and a second circuit operating on a second signal of a second frequency. The first signal is different from the second signal, and the first circuit and the second circuit share a first component. The first component functions as an antenna for the second circuit, which reduces space occupied by a dedicated or independent antenna and achieves smaller size and better industrial design for the electronic device.

The present invention provides a printed circuit board comprising: a dielectric layer (130) ; N pairs of differential signal vias (2) which penetrate through the dielectric layer wherein N is an integer more than one; N pairs of first strip conductors (101,102) disposed on a first surface of the dielectric layer; a first ground conductor layer (103) disposed in the dielectric layer forming N first differential transmission lines (100) with the N pairs of first strip conductors and the dielectric layer; N pairs of second strip conductors (111,112) disposed on a second surface of the dielectric layer; a second ground conductor layer (113) disposed in the dielectric layer forming N of second differential transmission lines (110) with the N pairs of second strip conductors and the dielectric layer.