A package for an optical module includes a substrate provided through a side wall in a first direction. The substrate includes a first wiring layer including a first signal terminal, a second signal terminal, and a first ground terminal. The package includes a second wiring layer disposed under the first wiring layer. The second wiring layer includes a first ground pattern and a first insulating layer disposed between the first wiring layer and the second wiring layer, and includes a groove extending along the first direction, the groove being filled with a metal. The groove is provided within the first ground terminal, in a plan view, and the first insulating layer is free of the groove. The first ground terminal is electrically coupled to the first ground pattern through the metal of the groove.

A port may include a connector and an enclosure for the connector. The enclosure may be mounted to a support substrate. The enclosure may include pins that are received within openings in the support substrate. If desired, one or more of the pins may have characteristics that improve retention of the enclosure to the support substrate. If desired, the enclosure may have indents that create a friction fit with the connector. If desired, adhesive may be used to attach the enclosure to the support substrate.

Technologies for radiofrequency optimized interconnects for a quantum processor are disclosed. In the illustrative embodiment, signals are carried in coplanar waveguides on a surface of a quantum processor die. A ground ring surrounds the signals and is connected to the ground conductors of each coplanar waveguide. Wire bonds connect the ground ring to a ground of a circuit board. The wire bonds provide both an electrical connection from the quantum processor die to the circuit board as well as increased thermal coupling between the quantum processor die and the circuit board, increasing cooling of the quantum processor die.

An electronic device includes a first circuit operating on a first signal of a first frequency and a second circuit operating on a second signal of a second frequency. The first signal is different from the second signal, and the first circuit and the second circuit share a first component. The first component functions as an antenna for the second circuit, which reduces space occupied by a dedicated or independent antenna and achieves smaller size and better industrial design for the electronic device.

A network switch includes a circuit board and a plurality of transmission ports. The circuit board is disposed in a chassis, and an opening of the chassis is corresponding to a first reference line. The plurality of transmission ports are disposed on an edge of the circuit board. The edge is corresponding to a second reference line, and the first reference line and the second reference line form an acute angle.