The present invention relates to an isolation mechanism of a controller for a direct current circuit breaker, which has a simple structure for isolation and connection manipulation. The isolation mechanism of a controller for a circuit breaker comprises a first connector that has a plurality of output terminals electrically connected to the controller and a plurality of input terminals detached from the output terminals for connecting an input electric power source; and a second connector that has a first connection position connected to the first connector and a second connection position rotated at 180 from the first connection position and connected to the first connector, and has a conductor wiring portion electrically connecting the output terminals with the input terminals at the first connection position and electrically disconnecting the output terminals from the input terminals at the second connection position.

A modularization of a circulator and a directional coupler used in a wireless communication system comprises: a circulator; and a signal coupler, where the signal coupler does not have directivity by itself, and directivity of the circulator module is controlled by isolation characteristics of the circulator to improve electrical characteristics of a wireless communication system and miniaturize the wireless communication system by applying the electrical characteristics in common with a circulator to modularize the wireless communication system without implementation of a circuit of a directional coupler capable of sampling high-frequency signals.

The present invention provides a printed circuit board comprising: a dielectric layer (130); N pairs of differential signal vias (2) which penetrate through the dielectric layer wherein N is an integer more than one; N pairs of first strip conductors (101, 102) disposed on a first surface of the dielectric layer; a first ground conductor layer (103) disposed in the dielectric layer forming N first differential transmission lines (100) with the N pairs of first strip conductors and the dielectric layer; N pairs of second strip conductors (111,112) disposed on a second surface of the dielectric layer; a second ground conductor layer (113) disposed in the dielectric layer forming N of second differential transmission lines (110) with the N pairs of second strip conductors and the dielectric layer.

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a radio frequency (RF) die having a lateral surface area and a plurality of contacts on a face, where the RF die is embedded in the package substrate with the plurality of contacts facing towards the second surface of the package substrate, and an RF front end between the RF die and the first surface of the package substrate, where the RF front end is positioned under the RF die and does not extend beyond the lateral surface area of the RF die.

A multi-terminal capacitor is provided that can be used either as a feedthrough capacitor or as a LW reversal capacitor. A multi-terminal capacitor includes a capacitor body shaped like a rectangular parallelepiped. The capacitor body includes a capacitance forming portion configured to form capacitance between a first conductor film and a second conductor film facing each other with a dielectric film being interposed therebetween. On one of the surfaces of the capacitor body in the third direction, first and second external terminals electrically connected to the first conductor film, and a third external terminal electrically connected to the second conductor film are provided. On the other of the surfaces of the capacitor body in the third direction, fourth and fifth external terminals electrically connected to the first conductor film and a sixth external terminal electrically connected to the second conductor film are provided.

The present invention provides a printed circuit board comprising: a dielectric layer (130); N pairs of differential signal vias (2) which penetrate through the dielectric layer wherein N is an integer more than one; N pairs of first strip conductors (101, 102) disposed on a first surface of the dielectric layer; a first ground conductor layer (103) disposed in the dielectric layer forming N first differential transmission lines (100) with the N pairs of first strip conductors and the dielectric layer; N pairs of second strip conductors (111,112) disposed on a second surface of the dielectric layer; a second ground conductor layer (113) disposed in the dielectric layer forming N of second differential transmission lines (110) with the N pairs of second strip conductors and the dielectric layer.

A composite electronic component includes: a first electronic component including a ceramic body having a main surface caused to face a circuit board at a time of mounting and first and second end surfaces orthogonal to the main surface, and a first external electrode and a second external electrode respectively provided to the first end surface and the second end surface and respectively extending from the first end surface and the second end surface to the main surface; and a second electronic component including a functional film provided to the main surface, and a first electrode film and a second electrode film provided to both end portions of the functional film separately from the first external electrode and the second external electrode, the second electronic component being configured to fit within a thickness of each of the first external electrode and the second external electrode from the main surface.

A connecting device comprises housing, a board with electrical components, including at least one digital bus connection and an input/output section. It allows outsourcing of analog and digital I/O from a connected device, e.g. an HVAC actuator control unit by decentralizing inputs and outputs.

A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.

A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.