Methods for manufacturing a microwave or radio frequency (RF) device include mounting a printed circuit board (PCB) on a flexible PCB having at least one ground plane and a signal terminal. The PCB can include a through-hole the sidewalls of which are coated with a conductive material. The methods can include placing a microwave component within the through-hole. The methods can include disposing a conductive cover on the PCB such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding around the microwave component. The flexible PCB can be folded along a respective bend portion.

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a radio frequency (RF) die having a lateral surface area and a plurality of contacts on a face, where the RF die is embedded in the package substrate with the plurality of contacts facing towards the second surface of the package substrate, and an RF front end between the RF die and the first surface of the package substrate, where the RF front end is positioned under the RF die and does not extend beyond the lateral surface area of the RF die.

A high-frequency module includes a circuit board including wiring patterns, a resin on an active element mounted on the circuit board and a side of the circuit board and sealing the active element, and connection conductors penetrating the resin from a surface of the resin and provided on a top surface of the active element. The active element includes a first connection electrode on a surface facing the circuit board, and a second connection electrode on a top surface opposite to the surface facing the circuit board. The first connection electrode is connected to a wiring pattern on the circuit board, and the second connection electrode is connected to the connection conductor and an outer electrode and is not connected to the wiring pattern.

This application discloses a chip power supply system, a chip, a PCB, and a computer device. The chip power supply system includes a first printed circuit board (PCB), a chip, a power controller, and an inductor module. The first PCB includes N vias, first ends of the N vias are located at a top layer of the PCB, and second ends of the N vias are located at a bottom layer of the first PCB. The chip is coupled to the top layer of the first PCB through N power supply contacts and the first ends of the N vias. The inductor module is coupled to the chip through M power supply contacts and the second ends of M vias of the N vias. The power controller is coupled to the inductor module through the first PCB, and the power controller is configured to control the inductor module to supply power to the chip.

An electronic device is disclosed. An electronic device according to an embodiment may include: a first Printed Circuit Board (PCB), a second PCB, a Radio Frequency (RF) transceiver disposed on the first PCB, a Flexible Printed Circuit Board (FPCB) coupled with the first PCB and the second PCB and electrically coupled with the RF transceiver, the FPCB including a transmission line of a wireless communication signal, an amplifier disposed on the second PCB and electrically coupled with the RF transceiver by the FPCB, a first antenna electrically coupled with the amplifier through the second PCB and configured to receive a wireless communication signal corresponding to a first frequency, and a second antenna electrically coupled with the amplifier through the second PCB and configured to receive a wireless communication signal corresponding to a second frequency. The first antenna and the second antenna may be disposed closer to the second PCB than the first PCB in the electronic device. The amplifier may amplify a wireless communication signal received from the first antenna and second antenna.

A common mode filter is disposed on a circuit board. A signal layer of the circuit board has a differential signal wire pair. The common mode filter has a slot structure and a filtering frequency adjusting device. The slot structure is formed on a reference voltage layer of the circuit board, wherein the slot structure surrounds the differential signal wire pair. The filtering frequency adjusting device is disposed on a corner part of the slot structure, wherein the filtering frequency adjusting device includes at least one of at least one capacitor and at least one inductor, and is disposed on the circuit board across the differential signal wire pair.

An electronic module includes a first semiconductor device disposed on a first main surface of an insulating board of a printed wiring board, a first capacitor disposed on a second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in a direction perpendicular to the first main surface, and a second capacitor disposed on the second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in the direction perpendicular to the first main surface. A second electrode of the first capacitor is electrically connected to a ground pattern via a first ground via of the printed wiring board. A fourth electrode of the second capacitor is electrically connected to the ground pattern via a second ground via of the printed wiring board.

A common mode filter is disposed on a circuit board. A signal layer of the circuit board has a differential signal wire pair. The common mode filter has a slot structure and a filtering frequency adjusting device. The slot structure is formed on a reference voltage layer of the circuit board, wherein the slot structure surrounds the differential signal wire pair. The filtering frequency adjusting device is disposed on a corner part of the slot structure, wherein the filtering frequency adjusting device includes at least one of at least one capacitor and at least one inductor, and is disposed on the circuit board across the differential signal wire pair.

Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate. An inductor may be positioned in the substrate. Electromagnetic interference (EMI) shield elements may be positioned within the substrate and surrounding the inductor. Other embodiments may be described or claimed.

In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient α.sub.LS, which is substantially higher than the first thermal conductivity coefficient α.sub.S of the substrate. The heat dissipation then succeeds via the heat-conducting means and via connecting means which connect the substrate to a carrier.