A high-frequency module includes an antenna terminal, a transmission signal terminal, a reception signal terminal, a plurality of earth terminals, a switch, a transmission filter, a reception filter, and a multilayer board. The multilayer board includes a ground electrode arranged between the transmission filter and the reception filter. The plurality of earth terminals include a first earth terminal and a second earth terminal. When the high-frequency module is viewed in a direction perpendicular to a principal surface of the multilayer board, the reception signal terminal is provided between the antenna terminal and the transmission signal terminal, the first earth terminal is provided between the antenna terminal and the reception signal terminal, and the second earth terminal is provided between the reception signal terminal and the transmission signal terminal.

A LED light driver having a reduced overall thickness so as to facilitate placement within an octagon junction box and canopy. The LED light driver of the present invention includes a printed circuit board wherein the printed circuit board includes a first side and a second side and is planar in manner. The printed circuit board further includes a plurality of recesses formed on the first side and second side thereof so as to facilitate the reduction in the overall Z dimension of the LED light driver. The printed circuit board includes a metal base having an epoxy material utilized for insulation and an exterior case material. The metal base enclosed inside the epoxy further functions as a heat sink. The reduced height of the present invention further provides for less blockage of light and as such the LED light drive can be more proximate the light source.

Disclosed herein are dual-spiral common-mode filters, printed circuit boards (PCBs) comprising such dual-spiral common-mode filters, and devices comprising such dual-spiral common-mode filters and PCBs. A dual-spiral common-mode filter is patterned into the reference plane of a PCB. The dual-spiral common-mode filter comprises a first spiral portion connected to a second spiral portion. The spiral portions may be substantially identical, or mirror images of each other, or different from each other. One or more signal traces in a signal trace layer of the PCB pass over the dual-spiral common-mode filter. The disclosed dual-spiral common-mode filters can replace both conventional patterned ground structure (PGS) filters used for radio-frequency interference mitigation and the cutouts often used in the reference plane of a PCB to mitigate impedance mismatches due to DC blocking capacitors. Also disclosed herein are methods of making PCBs that include dual-spiral common-mode filters.

A filter module includes a first ground terminal, a second ground terminal, a low pass filter, and a second inductor. The low pass filter includes a first inductor provided in an input/output path of signal, a first capacitor provided in a first path connecting a first node and the first ground terminal, and a second capacitor provided in a second path connecting a second node and the second ground terminal. The second inductor is connected in series to the second capacitor in a path connecting the second capacitor and the second ground terminal. The first path and the second path are not connected to each other by any path except the one between the first node and the second node.

A microwave or radio frequency (RF) device includes stacked printed circuit boards (PCBs) mounted on a flexible PCB having at least one ground plane and a signal terminal. Each of the stacked PCBs includes through-holes the sidewalls of which are coated with a conductive material. Microwave components are mounted on the flexible PCB within the through-holes, such that signal terminals of the components bond to signal terminals of respective through-holes. A conductive cover is mounted on the PCBs such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding cavities around the components. The flexible PCB is folded such that the cover of one PCB faces the cover of the second PCB. The flexible PCB includes striplines or microstrips that carry RF or microwave signals to the signal terminals.

In some aspects, a flexible cable may comprise: a flexible strip with first and second parallel surfaces and first and second ends, said flexible strip being electrically insulating; a metal stripline within said flexible strip; first and second metallic grounding planes on said first and second surfaces, respectively; and a first circuit board mechanically attached to at least one of said first end of said flexible strip and said first and second metallic grounding planes at said first end, said first circuit board being mechanically stiff, said metal stripline being electrically connected to electrical circuitry on said first circuit board.

An electric pump is provided. The electric pump includes a PCB board, where the PCB board is formed with a power input port. The electric pump further includes a common mode filter, where the common-mode filter includes a common mode inductor, and the common mode inductor is arranged close to the power input port; and in a direction perpendicular to a plane on which the PCB is located, no wiring is provided at the common mode inductor corresponding to a wiring film layer in the PCB.

A communications module includes a module substrate composed of a plurality of insulating layers, a plurality of wiring layers, and a plurality of wiring vias; and a filter module disposed on the module substrate. At least one of the wiring layers overlaps the filter module in a thickness direction of the module substrate and is connected to a ground potential to function as a ground layer, and an entirety of at least one of the wiring layers and at least one of the wiring vias disposed in a first region in the thickness direction of the module substrate between the filter module and the ground layer are electrically connected to the filter module.

An optical receiver circuit includes a light receiving element to convert an optical signal into a current signal, a submount substrate on which the light receiving element is mounted, a wiring connected to an anode pad of the light receiving element and a wire connected to a preamplifier on the submount substrate, a wiring to which a bias voltage is applied on the submount substrate; a wiring connected to a cathode pad of the light receiving element on the submount substrate; and a resistor connected to the wiring to serve as a path when the bias voltage is applied to the light receiving element via the wiring on the submount substrate. A resistance value of the resistor is determined such that a resonance peak between the preamplifier and ground is suppressed and that oscillation in the preamplifier is suppressed.

A first filter is prevented from being affected by the coplanarity of a mounting substrate and a degradation of the filter characteristics of the first filter is reduced. A first filter, a second filter, a third filter, and a first switch are mounted on a first principal surface of a mounting substrate. The first filter passes a first high-frequency signal and a second high-frequency signal, the second filter passes a third high-frequency signal, and the third filter passes a fourth high-frequency signal. The first switch is capable of simultaneously connecting the first filter and the second filter to an antenna terminal. In a plan view from a thickness direction of the mounting substrate, the first filter is larger than the second filter and the third filter and located between the second filter and the third filter. A first wire and a second wire are each shorter than a third wire.