An electronic component-containing module includes a board, electronic components, and a sealing resin and includes a space provided between the board and at least one of the electronic components. The dryness factor of the sealing resin is about 60% or more where, after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of a brazing filler metal.

A filter circuit includes: a first element that is a first capacitor or a first inductor connected in series between input and output terminals; a second element that is connected in parallel to the first element between the input and output terminals, is a second inductor when the first element is the first capacitor, and is a second capacitor when the first element is the first inductor; a third element that is connected in parallel to the first element and in series with the second element between the input and output terminals, is a third inductor when the first element is the first capacitor, and is a third capacitor when the first element is the first inductor; and an acoustic wave resonator having a first end coupled to a first node between the second element and the third element and a second end coupled to a ground terminal.

An electronic component includes: a first substrate; a second substrate that includes a functional element formed on a lower surface of the second substrate, the second substrate being mounted on the first substrate so that the functional element faces an upper surface of the first substrate across an air gap; and an insulating film that is located on the upper surface of the first substrate, overlaps with at least a part of the functional element in plan view, faces the functional element across the air gap, and has a film thickness that is more than half of a distance between a lower surface of the functional element and the upper surface of the first substrate.

An embodiment of an assembly includes a platform (e.g., a printed circuit board (PCB)), a sensor, and a vibration-cancel circuit. The sensor is mounted to the platform and is configured to generate a sense signal that represents a vibration induced (e.g., a shock-induced vibration) in the platform. And the vibration-cancel circuit is configured to reduce or eliminate a level of the vibration in response to the sense signal. For example, such a vibration-cancel circuit is configured to reduce a magnitude of a vibration induced in platform, or to eliminate the vibration altogether, by generating, in the platform, a counter vibration that has a magnitude approximately equal to the magnitude of the induced vibration and that has a phase approximately opposite to the phase of the induced vibration. That is, the counter vibration cancels the induced vibration to reduce the net vibration that the platform experiences.

A piezoelectric vibration module includes a vibration plate adapted to have one end fixed and the other end not fixed and driven in a vertical direction based on the fixed first end, a first piezoelectric element attached to the top or bottom of the vibration plate and adapted to generate a vibration power when power is applied, and a weight formed in the other end of the top or bottom of the vibration plate and adapted to control the vibration frequency of the piezoelectric vibration module. The first piezoelectric element is attached to the top or bottom of the vibration plate with a predetermined interval from a fixed point at the one end of the vibration plate.

A fluid driving system includes a vibration unit, a piezoelectric element, a signal transmission layer, a plane unit, and a protrusion. The piezoelectric element includes a first electrode and a second electrode electrically isolated from each other. The signal transmission layer includes a first conductive zone and a second conductive zone. The first electrode of the piezoelectric element is electrically connected to the first conductive zone of the signal transmission layer, and the second electrode of the piezoelectric element is electrically connected to the second conductive zone of the signal transmission layer. The plane unit has at least one hole. The piezoelectric element, the signal transmission layer, and the plane unit are located at one side of the vibration unit. The protrusion is located between the vibration unit and the plane unit, and the protrusion corresponds to and protrudes toward the at least one hole.

An embodiment of an assembly includes a platform (e.g., a printed circuit board (PCB)), a sensor, and a vibration-cancel circuit. The sensor is mounted to the platform and is configured to generate a sense signal that represents a vibration induced (e.g., a shock-induced vibration) in the platform. And the vibration-cancel circuit is configured to reduce or eliminate a level of the vibration in response to the sense signal. For example, such a vibration-cancel circuit is configured to reduce a magnitude of a vibration induced in platform, or to eliminate the vibration altogether, by generating, in the platform, a counter vibration that has a magnitude approximately equal to the magnitude of the induced vibration and that has a phase approximately opposite to the phase of the induced vibration. That is, the counter vibration cancels the induced vibration to reduce the net vibration that the platform experiences.

A first conductive pattern made from a conductive material is formed on a first surface that is one surface of a flexible film made from a dielectric material. An adhesive layer is disposed on a second surface opposite to the first surface of the flexible film. A pair of first outer electrodes generates an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and causes an electric current to flow through the first conductive pattern.

An electronic component includes an insulating surrounding member surrounding the electronic element while allowing a first surface of the electronic element to be exposed from a second surface of the surrounding member. A wiring board faces a third surface comprising the first and second surfaces. An insulating joining member is interposed between the third surface and the wiring board and joins the third surface and the wiring board together. A conductive bump, located between the third surface and the wiring board, electrically connects the electronic element and the wiring board. The joining member has a first through hole that overlaps a vibration region in the first surface in perspective plan view. The joining member has a second through hole that accommodates the bump. At least a portion of at least one of the first through hole or the second through hole overlaps the second surface in perspective plan view.

According to one embodiment, a printed circuit board includes a substrate and a shared pad group provided on the substrate and including a plurality of shared pads. The shared pads include a first area, a second area smaller in size than the first area, a port of which is overlap the first area and an other port of which is located to protrude from the first area to a side of another one of the shared pads, and a second side edge located on a side of another shared pad. The second pad side edge includes a first side edge defining the first area, a second side edge defining the second area and displaced on a side of another shared pad with respect to the first side edge, and a sloping side edge connecting the first side edge and the second side edge to each other.