An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.

The disclosure relates to the technical field of quartz crystal oscillators, in particular to a direct temperature measurement oven controlled crystal oscillator. The direct temperature measurement oven controlled crystal oscillator according to the present disclosure does not require additional components for measuring the temperature of the wafer inside the crystal oscillator. Instead, the temperature measurement device is disposed on the surface of the wafer to directly measure the temperature of the wafer itself, In order to achieve the exact temperature of the wafer itself. The oven controlled crystal oscillator according to the present disclosure has a simple in structure and is easy to be manufactured. The temperature of the wafer itself is directly measured to make temperature measurement more accurate.

An ovenized crystal oscillator assembly includes an oscillator package defining a cavity which houses an interposer assembly. The interposer assembly, which can be housed in a recess in the base of the oscillator package, includes a quartz resonator and an interposer with a thin-film heater and temperature sensor. The quartz resonator is connected to the interposer on its edge(s) that is/are mounted to mechanical standoffs which are connected to electrical pads located on the interposer.

There is provided a printed circuit board, on which a piezoelectric element for generating vibration is mounted, is fixed to a pedestal. Two slits are formed on a straight line that connects first position where the piezoelectric element is mounted on the printed circuit board and a second position where the printed circuit board is in contact with the pedestal.

A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode.

An electronic component housing package includes an insulating substrate including a first surface with a mounting region mounting an electronic component, a second surface located opposite to the first surface, a plurality of side surfaces located between the first surface and the second surface, and a corner portion located between two of the side surfaces; an external connection conductor located on the second surface; and a corner conductor connected to the external connection conductor. The corner conductor is located from the external connection conductor toward the corner portion in a manner to increase the distance from the second surface.

An oscillator comprising a support substrate, at least one transducer mounted on a first surface of the support substrate, and an integrated circuit element mounted on a second surface of the support substrate. The integrated circuit element includes first and second frequency generating components integrated therein. The first frequency generating component generates a first output frequency, and the second frequency generating component generates a second output frequency that is higher than the first output frequency. The oscillator also includes a ground terminal to which the second frequency generating component is closer than the first frequency generating component.

A wiring pattern for oscillation input signal and a wiring pattern for oscillation output signal are provided on a printed circuit board, and a wiring pattern for ground power source voltage is arranged in a region therebetween. A quartz crystal unit is connected between the wiring pattern for oscillation input signal and the wiring pattern for oscillation output signal and one ends of capacitors serving as load capacitors thereof are connected to the wiring pattern for ground power source voltage. Further, a wiring pattern for VSS is arranged so as to enclose these wiring patterns, and a wiring pattern for VSS is arranged also in a lower layer in addition thereto. By this means, reduction of a parasitic capacitance between an XIN node and an XOUT node, improvement in noise tolerance of these nodes and others can be achieved.

An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O.sub.2, N.sub.2O, NO.sub.2, H.sub.2, NH.sub.3, N.sub.2, SiF.sub.4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiO.sub.xH.sub.yC.sub.zF.sub.aN.sub.b. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.

An oscillator comprising a support substrate, at least one transducer mounted on a first surface of the support substrate, and an integrated circuit element mounted on a second surface of the support substrate. The integrated circuit element includes first and second frequency generating components integrated therein. The first frequency generating component generates a first output frequency, and the second frequency generating component generates a second output frequency that is higher than the first output frequency. The oscillator also includes a ground terminal to which the second frequency generating component is closer than the first frequency generating component.