H05K2201/10083

PCB structure for embedding electronic components

A PCB, printed circuit board, structure for forming at least one embedded electronic component. The structure comprises a multi-layer PCB board comprising at least one through-hole via, the via comprising a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring; and an isolation section separating each of the electrodes.

Backplane and method for producing same
11602067 · 2023-03-07 · ·

A backplane is for electrically connecting electrical components and a method is for producing a backplane. The backplane includes a base board, conducting tracks arranged on and/or in the base board, and at least one actuator unit arranged on or in the base board.

Systems and methods for communicating through a hard plastic mask

The present disclosure relates generally to providing a flexible patch and system for communicating through hard plastic masks such as CPAP/BiPAP® masks. Using electronic circuitry and novel designs, the present systems and methods can detect speech vibrations and output audible speech from hard plastic mask wearers. For example, in certain embodiments, the present systems and methods can recognize speech through a CPAP/BiPAP® mask, filter out non-human voice related noise, and output the resulting speech of the mask wearer.

Functional substrates for printed electronic devices

A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.

Systems and methods for communicating through a hard plastic mask

The present disclosure relates generally to providing a flexible patch and system for communicating through hard plastic masks such as CPAP/BiPAP® masks. Using electronic circuitry and novel designs, the present systems and methods can detect speech vibrations and output audible speech from hard plastic mask wearers. For example, in certain embodiments, the present systems and methods can recognize speech through a CPAP/BiPAP® mask, filter out non-human voice related noise, and output the resulting speech of the mask wearer.

INTEGRATED ACTIVE NOISE-CANCELING WIRELESS BLUETOOTH HEADPHONE
20220337948 · 2022-10-20 ·

The present disclosure relates to an integrated active noise-canceling wireless Bluetooth headphone, which comprises a housing assembly, primary and secondary magnet sets, primary and secondary magnetic conductive sheet sets, an integrated circuit board assembly, a bracket and a tuning net. The primary and secondary magnet sets, the primary and secondary magnetic conductive sheet sets, the integrated circuit board assembly and the bracket are sequentially laminated in the housing assembly; the tuning net is arranged on an outer surface above the housing assembly; the integrated circuit board assembly is integrated; the periphery of the integrated circuit board assembly is exposed outside the housing assembly; a noise-canceling speaker module interface is embedded in the exposed part of the integrated circuit board and electrically connected with the integrated circuit board; and a light-sensing in-ear detector is surface-mounted on the integrated circuit board.

Electronic device comprising multiple microphones

According to an embodiment of the present invention, an electronic device may comprise: a housing; a printed circuit board disposed inside the housing, the printed circuit board comprising a first surface, a second surface facing away from the first surface, and a first through-hole and a second through-hole penetrating the first surface and the second surface; a first microphone disposed on the second surface so as to at least partially overlap the first through-hole when seen from above the first surface; a second microphone disposed on the second surface so as to at least partially overlap the second through-hole when seen from above the first surface; a support member disposed on the first surface, the support member comprising a third surface facing the first surface, a fourth surface facing away from the third surface, a third through-hole at least partially overlapping the first through-hole when seen from above the first surface, and a fourth through-hole at least partially overlapping the second through-hole when seen from above the first surface; a first sound-transmitting member disposed on the fourth surface so as to at least partially overlap the third through-hole; and a second sound-transmitting member disposed on the fourth surface so as to at least partially overlap the fourth through-hole. Various other embodiments may be included.

WIRING CIRCUIT BOARD
20230156914 · 2023-05-18 · ·

A suspension board with circuit including a first mounting region for mounting a slider and a second mounting region for mounting a piezoelectric element. The wiring circuit board includes a metal support layer, a base insulating layer, and a conductive layer. The conductive layer includes a first wiring pattern, a second wiring pattern, and a shield wiring pattern. The first wiring pattern includes a read wiring. The second wiring pattern includes a power supply wiring disposed at spaced intervals to the read wiring. The shield wiring pattern includes a shield wiring disposed between the read wiring and the power supply wiring.

Air transport unit
20230147184 · 2023-05-11 · ·

An air transport unit comprising a composite board. The composite board comprising an anode layer and a cathode layer of an electrically conducting material. The anode layer and cathode layer are separated by an insulator of an electrically insulating material. The composite board further comprising an electric component in electrical connection with the anode layer and the cathode layer. The air transport unit further comprising a carrier board, wherein the composite board and the carrier board each have a duct forming surface, which carrier board and composite board are arranged so that an air duct forms between the duct forming surfaces.

Tactile perception apparatus for robotic systems

A human-like tactile perception apparatus for providing enhanced tactile information (feedback data) from an end-effector/gripper to the control circuit of an arm-type robotic system. The apparatus's base structure is attached to the gripper's finger and includes a flat/planar support plate that presses a pressure sensor array against a target object during operable interactions. The pressure sensor array generates pressure sensor data that indicates portions of the array contacted by surface features of the target object. A sensor data processing circuit generates tactile information in response to the pressure sensor data, and then transmits the tactile information to the robotic system's control circuit. An optional mezzanine connector extends through an opening in the support plate to pass pressure sensor data to the processing circuit. An encapsulating layer covers the pressure sensor array and transmits pressure waves generated by slipping objects to enhance the tactile information.