H05K2201/10083

Assembly comprising at least an electrical component mounted on a substrate, a component suitable for such an assembly as well as a method for mounting an electrical component on a substrate

An assembly comprising at least an electrical component mounted on a substrate. The component includes at least a first electrode and a second electrode. The substrate includes at least a first electrical conductor and a second electrical conductor. The first electrode is electrically connected to the first electrical conductor and the second electrode is electrically connected to the second electrical conductor. In a direction perpendicular to the substrate, the first electrode is located between the first electrical conductor and the second electrode. The second electrode is connected to the second electrical conductor by a connecting element extending between the second electrode and the second electrical conductor.

Connecting member for electronic device and electronic device including the same

A connecting member for electrically connecting a circuit board and a component in an electronic device is provided. The connecting member includes at least one bending part configured to comprise elasticity, a pad part connected to the bending part and configured to be attached to one surface of the circuit board, and a fixing part extending from the pad part and configured to fix the connecting member to the circuit board.

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING THE SAME
20220385751 · 2022-12-01 · ·

The present disclosure relates to a printed circuit and an electronic device including the same. The printed circuit board includes a first substrate having a through portion, a second substrate disposed in the through portion of the first substrate, and in which at least a portion of a side surface thereof is surrounded by the first substrate, and a flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates.

Portable speaker system

A portable audio input/output device may include one or more openings that extend through a cover of the device and allow acoustic signals outside a housing of the device to reach a microphone disposed within the housing. The opening(s) may be illuminated by a light guide disposed within the housing, which scatters light emitted from lights disposed within the housing. In some instances, a hole may pass through a printed circuit board to allow acoustic signals to be received by the microphone disposed below the printed circuit board. An input/output (I/O) interface module with multiple buttons and inputs may be installed in the hole. The multiple buttons and I/O ports of the I/O interface module may be aligned along an axis vertical relative to the housing and centered with respect to each other.

Camera Module and Array Camera Module Based on Integral Packaging Technology
20170353646 · 2017-12-07 ·

A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

Fabric-Mounted Components

Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

ELECTRONIC DEVICE COMPRISING MICROPHONE MODULE
20230188879 · 2023-06-15 · ·

In an electronic device, at least a portion of a camera cover member is disposed inside a housing. The camera cover member includes a through-hole in fluid communication with the outside of the housing, and is formed to support a camera module disposed inside the housing. A microphone module is disposed inside the housing so as to be adjacent to the camera module, and includes a first circuit board disposed on the camera cover member and a microphone disposed on the first circuit board. A second circuit board is disposed to face the camera cover member with the microphone module therebetween, and includes a contact structure in contact with the first circuit board. The contact structure is configured to electrically connect the first circuit board to the second circuit board and can be disposed between the first circuit board and the second circuit board to surround the microphone.

Speaker and microphone integrated display panel

Provided is a speaker and microphone integrated display panel including: a display panel having a display area and a non-display area surrounding the display area; and a simultaneously convertible film type speaker or film type microphone which is mounted to correspond to an air hole in the non-display area, in which the display panel and the film type speaker or the film type microphone are at least partially integrated so as to be drive-connected.

Display device

A display device includes: a display panel including a first substrate, a second substrate, and a light emitting element layer disposed between the first substrate and the second substrate, where the light emitting element outputs light to the second substrate; a first sound generator disposed on a surface of the first substrate, where the first sound generator vibrates the display panel to output a sound; and a first buffer member disposed on the surface of the first substrate, where a height of the first buffer member is less than a height of the first sound generator.

Speaker
20230179921 · 2023-06-08 ·

The present disclosure discloses a speaker including a frame, a vibration system, and a magnetic circuit system. The vibration system includes an upper diaphragm, an elastic supporting member, a skeleton, and a voice coil. The upper diaphragm includes a suspension, an inner fixing part fixed to the skeleton, and an outer fixing part fixed to the frame. The skeleton includes a main body part and an extension part. The elastic supporting member is fixed to the extension part. The main body part together with the upper diaphragm separates an internal space of the speaker from an outside space. Compared with the related art, the speaker disclosed by the present disclosure has a better acoustic performance.