A circuit board assembly includes a first circuit board, a second circuit board having a first side extending adjacent to a first side of the first circuit board, and a metal fitting including a portion bent at the angle and spanning both the first side of the first circuit board and the first side of the second circuit board. The second circuit board is in a posture having an angle other than 180° to the first circuit board. The metal fitting is fixed to both the first circuit board and the second circuit board.

An electronic device of various embodiments of the present disclosure may include: a display, a side bezel including at least one conductive portion, and a printed circuit board disposed inside the side bezel. The printed circuit board may include an interposer, and a first printed circuit board and a second printed circuit board electrically connected through the interposer. The first printed circuit board may include a first fill-cut area, and the second printed circuit board may include a second fill-cut area corresponding to the first fill-cut area, and a ground or feeding unit comprising a conductive feed of an antenna using the conductive portion may be disposed in the first fill-cut area or the second fill-cut area.

A battery charging apparatus for device charging in a vehicle includes a charging device compartment, a housing, a blower, a charger, and a duct. The charging device compartment is configured to retain at least one device. The housing includes a top member, a bottom member, and an accommodating space. The housing further includes an air-return port. The blower is in the housing and has an input port and an output port. The charger is in the housing and between the top member of the housing and the blower. The duct has an input port and an output port. The input port of the duct is coupled to the output port of the blower, and the output port of the duct is coupled to the air-return port of the housing. The duct forms a barrier between the accommodating space and the air-return port of the housing.

At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate. The active component is disposed on the substrate and electrically connected to the antenna. A location of the antenna is configured to be adjustable with respect to a location of the active component.

An antenna apparatus includes: a feed line; a first ground layer including surface disposed above or below the feed line and spaced apart from the feed line; and an antenna pattern electrically connected to an end of the feed line and configured to transmit and/or receive a radio frequency (RF) signal, wherein the first ground layer includes a first protruding region protruding in a first longitudinal direction of the surface toward the antenna pattern and at least partially overlapping the feed line above or below the feed line, and second and third protruding regions protruding in the first longitudinal direction from positions spaced apart from the first protruding region in opposite lateral directions of the surface.

For example, an apparatus may include a Printed Circuit Board (PCB) including a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect a Surface Mounted Device (SMD) to the PCB; an antenna disposed on a second side of the PCB opposite to the first side, the antenna to communicate a Radio Frequency (RF) signal of the SMD; and an RF transition to transit the RF signal between the BGA and the antenna, the RF transition including a plurality of signal buried-vias; a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna.

An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.

Disclosed are various embodiments related to a circuit board included in an electronic device. According to one embodiment, the circuit board may comprise: a core layer including an upper surface and a lower surface and formed as a substrate made of a prepreg material; a first flexible copper clad laminate including a plurality of conductive layers and laminated on the upper surface; at least one first substrate layer laminated above the first flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material; a second flexible copper clad laminate including a plurality of conductive layers and laminated on the lower surface; and at least one second substrate layer laminated under the second flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material. Various other embodiments are also possible.

There is provided a new type of structure that resonates at a predetermined frequency, an antenna, a wireless communication module, and a wireless communication device. The structure includes a first conductor that extends in a second direction, a second conductor, a third conductor, a fourth conductor. The second conductor faces the first conductor in a first direction and that extends along the second direction. The third conductor is configured to capacitively connect the first conductor and the second conductor. The fourth conductor is configured to be electrically connected to the first conductor and the second conductor and extends along a first plane. Each of the first conductor and the second conductor includes a portion that extends along the second direction and that is exposed to an exterior space.

A structure includes first to a first conductor, a second conductor, a third conductor, and a fourth conductor. The first conductor extends along a second plane including a second direction and a third direction intersecting with the second direction. The second conductor faces the first conductor along a first direction intersecting with the second plane and extends along the second plane. The third conductor capacitively connects the first conductor and the second conductor. The fourth conductor is electrically connected to the first conductor and the second conductor, and extends along a first plane including the first direction and the third direction. The third conductor faces the fourth conductor via a base. The base includes a plurality of first fiber components and a first resin component that holds the first fiber components. Part of the first fiber components extends along the first direction.