An embodiment electronic device includes a ground plane; and an antenna. The antenna includes a first trace having a first end and a second end, the second end of the first trace being electrically coupled to the ground plane. The antenna also includes a second trace distinct and physically separated from the first trace, the second trace having a first end and a second end, the second end of the second trace being electrically coupled to the ground plane, the first trace and the second trace forming discontinuous portions of the antenna.

A biocompatible electrical connection includes a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate. The second adhesive fills an annular space between a hole in the substrate and the ferrule. The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate.

Electronic device includes a housing; an antenna module accommodated in the housing, the antenna module including a PCB including a first side and a second side opposite to the first side; one or more antenna elements disposed at the first side of the PCB; and a wireless communication circuit disposed at the second side of the PCB and configured to transmit and/or receive a radio signal through an antenna element of the one or more antenna elements; and a conductive member accommodated in the housing and including a supporting portion and a connecting portion extended from the supporting portion and connected to the conductive portion of the housing, the supporting portion configured to support the antenna module such that the first side of the PCB faces in a direction toward the lateral surface of the electronic device, and the connecting portion including a hole through which a fastening member is disposed to fasten the conductive member to the conductive portion of the housing. Heat generated by the antenna module is transferred to the conductive portion of the housing.

An antenna substrate includes: a first substrate including an antenna pattern disposed on an upper surface of the first substrate; a second substrate having a first planar surface, an area of which is smaller than an area of a planar surface of the first substrate; and a flexible substrate connecting the first and second substrates to each other and bent to allow the first planar surface of the second substrate to face a side surface of the first substrate, which is perpendicular to the upper surface of the first substrate.

An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.

An electronic device includes a microphone module and a printed circuit board on which the microphone module is disposed. The printed circuit board includes a first layer having at least one first microphone pad coupled to the microphone module, a first ground spaced apart from the first microphone pad, and a second microphone pad coupled to the microphone module and connected to the first ground; and a second layer disposed under the first layer and having a second ground opposite to the first microphone pad and at least a part of the first ground.

A transparent antenna includes a substrate, an antenna grid layer, and a ground grid layer. The substrate has an electrically conductive hole extending from two opposite surfaced of the substrate. The antenna grid layer is formed on a surface of the substrate. The antenna grid layer includes a feeding portion and a transmission portion. The ground grid layer is formed on another surface of the substrate. The ground grid layer is coupled to the feeding portion of the antenna grid layer via the electrically conductive hole. An offset distance between a projection of a gridline of the antenna grid layer on the first surface and a projection of a gridline of the ground grid layer on the first surface is smaller than or equal to half of a difference between a line width of the antenna grid layer and a line width of the ground grid layer.

An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.

The present invention relates to a carrier substrate (30) comprising signal vias (41) for electrically interconnecting components (10, 31) arranged on opposing sides of the carrier substrate (30). The carrier substrate (30) further comprises: at least one cavity (20) embedded in the carrier substrate (30) having at least one chamber wick part (24) and a working fluid, and wherein the at least one cavity (20) at least partially encompass the signal vias (41). The present invention also relates to an electronic assembly and an apparatus for wireless communication comprising the carrier substrate (30).

An inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, and connects a plurality of circuit portions. The flexible substrate includes a rigid portion and a flexible portion, the rigid portion being wider than the flexible portion. The rigid portion includes the coil and a joining portion connected to another circuit. The coil includes two coil portions located at different positions in plan view, a flexible portion is located adjacent to one side of the rigid portion, and at least two coil portions of the plurality of coil portions are located on the one side when viewed from the joining portion.