The invention relates to an element in the shape of a sensor, an active electronic component, a switch, a circuit, or an electric conducting path for integration into a surrounding medium. The element is penetrable by the surrounding medium and has a porous, non-conductive substrate and at least one circuit trace made of conductive material present on the substrate. The openings of the substrate are open in an area of the circuit trace. The use and manufacture of the element are also provided.

Glare and/or multiple shadows are reduced and/or prevented in an SMD-type lighting fixture using high-power CSP devices. A lighting apparatus includes: a substrate having a plurality of conduction parts; and a plurality of surface mount-type LED elements mounted so as to be connected to the respective plurality of conduction parts which the substrate has, the individual elements being separately sealed, wherein the substrate includes a fluorescent substance layer containing a first fluorescent substance, the layer covering at least part of a surface on a side where the plurality of surface mount-type LED elements are mounted, the first fluorescent substance is excited at a wavelength of emitted light from at least one of the plurality of surface mount-type LED elements, and the plurality of surface mount-type LED elements are not integrally sealed.

An LED lamp having a metal PCB bent polyhedrally and a method for manufacturing the LED lamp is provided, where a base constituting the metal PCB has a rectangular or geometric shape and is configured to have a plurality of base stepped grooves formed spaced apart from each other on the underside thereof in such a manner as to be bent upward or downward from the base to form reflection surfaces continuously, so that at the time when both ends of the base come into contact with the plane, the base has a geometric shape in which the base is located in space through the reflection surfaces continuously arranged.

A combination standoff and LED includes a surface mount solder standoff which can be either threaded or unthreaded, and a surface mount LED disposed and fixed in the center of the base of the standoff. The combination standoff and LED is adapted to receive a lightpipe via the either threaded or unthreaded portion of the surface mount solder standoff. This combination standoff and LED results in a single piece of hardware which simplifies the physical PCBA layout design and removes any Computer Aided Design (CAD) placement errors that would normally be present if two separate hardware components were placed together manually.

An embodiment relates to a lighting device. An embodiment may comprise a lighting device comprising: a light emitting module comprising a circuit board and a plurality of light emitting devices arranged on the circuit board; and a coupling member coupled to the lower surface of the circuit board, wherein the coupling member comprises: a head portion arranged on the lower surface of the circuit board and comprising a first side, a second side opposite the first side, a third side connected to the first side and the second side, and a fourth side opposite the third side; a first support portion extending from one end portion of the head portion in the vertical direction; a second support portion extending from the other end portion of the head portion in the vertical direction; a first elastic portion bent from the first support portion in an outward direction from the first support portion; a second elastic portion bent from the second support portion in an outward direction from the second support portion; a first detachment preventing portion extending from an end of the first elastic portion toward the first support portion; a second detachment preventing portion extending from an end of the second elastic portion toward the second support portion; a first leg portion extending from an end of the first detachment preventing portion toward the lower surface of the circuit board; and a second leg portion extending from an end of the second detachment preventing portion toward the lower surface of the circuit board, wherein the first leg portion has a plurality of first elastic pieces, the second leg portion has a plurality of second elastic pieces, the first elastic pieces of the first leg portion are inclined outwards from the first leg portion, and the second elastic pieces of the second leg portion are inclined outwards from the second leg portion.

A ruggedized direct-view LED display system (100) includes a bonding matrix (215) that helps secure an array of LED chips (205) to a printed circuit board (PCB) (210). The bonding matrix may consist of an epoxy or other resin deposited on the surface (310) of the PCB after soldering the LED chips to the PCB. The bonding matrix has a thickness that is less than the thickness of the LED chips so that light-emitting outer portions (415) of the LED chips are not covered by the bonding matrix material. A method of forming the bonding matrix is also disclosed, including depositing bonding matrix material onto the PCB between the LED chips using nozzles or needles, optionally wicking excess bonding matrix material, and optionally degassing the bonding matrix material before curing it to form the bonding matrix.

This heat sink integrated insulating circuit substrate includes: a heat sink including a top plate part and a cooling fin; an insulating resin layer formed on the top plate part of the heat sink; and a circuit layer made of metal pieces arranged on a surface of the insulating resin layer opposite to the heat sink, wherein, when a maximum length of the top plate part is defined as L, an amount of warpage of the top plate part is defined as Z, and deformation of protruding toward a bonding surface side of the top plate part of the heat sink is defined as a positive amount of warpage, and a curvature of the heat sink is defined as C=|(8×Z)/L.sup.2|, a ratio P/C.sub.max between a maximum curvature C.sub.max(l/m) of the heat sink during heating from 25° C. to 300° C. and peel strength P (N/cm) of the insulating resin layer satisfies P/C.sub.max>60.

An LED lighting strip, method of manufacturing an LED lighting strip and an automotive lighting system are described. The LED lighting strip includes at least two outer wires, at least one central wire between the two outer wires, LEDs arranged along the LED lighting strip and electrically coupled at least to the at least two outer wires, and an enclosing member enclosing the at least two outer wires, the at one central wire and the LEDs. The at least two outer wires and the least one central wire have a bend in sections between at least some adjacent LEDs.

An electronic device with an active region comprising a substrate; a first conducting layer, disposed on the substrate, comprising a first pad in the active region; a second conducting layer, disposed on the first conducting layer, comprising a second pad in the active region; a first electronic component, disposed on the first pad, and electronically connected to the first pad; and a second electronic component, disposed on the second pad, and electronically connected to the second pad.

An electronic component sub-mount includes a body having a top surface, a bottom surface, and a supporting surface. The top and bottom surfaces are located on opposite sides of the body. The supporting surface is located on one side of the body, and an angle that is not equal to 0 degrees is formed between the supporting surface and the bottom surface. A first conductive layer is disposed on the bottom surface and includes multiple first conductive lines. A second conductive layer is disposed on the supporting surface, extending to the top surface, and includes multiple second conductive lines. The second conductive lines on the supporting surface have a first pin layout, and the second conductive lines on the top surface have a second pin layout different from the first pin layout. The second pin layout matches the pin layout of first conductive lines on the bottom surface.