A printed circuit board, on which at least one light emitting diode including at least two electrodes is mounted, includes a base member, an insulating layer disposed on the base member, a plurality of conductive pads disposed on the insulating layer and electrically connected to the light emitting diode, a plurality of via holes formed through at least one conductive pad of the plurality of conductive pads and at least a portion of each insulating layer, and filling members disposed in the plurality of via holes to electrically connect the base member to the at least one conductive pad, A distance between the plurality of via holes is ‘n’ times greater than a depth of at least one via hole of the plurality of via holes, in which ‘n’ is a positive integer greater than ‘1’ and less than ‘10’.

Proposed is an epoxy flux film that is to be positioned between a semiconductor substrate and a device and is heated and pressed without addition of an additional flux. Thus, device-substrate soldering and sealing are simultaneously performed, and interference of light reflected from the solder can be reduced.

Features relating to a vaporizer body are provided. The vaporizer body may include an outer shell that includes an inner region defined by an outer shell sidewall. A support structure is configured to fit within the inner region of the outer shell. The support structure includes a storage region defined by a top support structure, a bottom support structure, a bottom cap, and a gasket. An integrated board assembly is configured to fit within the storage region of the support structure. The integrated board assembly may include a printed circuit board assembly formed of multiple layers that form a rigid structure and that include an inner, flexible layer. A first antenna is integrated at a proximal end of the flexible layer, and a second antenna is integrated at a distal end of the flexible layer.

Provided is a display device, including: an array substrate having a display area and a non-display area at least partially surrounding the display area, and the non-display area includes a step region, and a part of the display area is reused as a fingerprint recognition region; a flexible circuit board bonded to the step region and bent to a side of the array substrate facing away from a light-exiting direction of the display device, and the flexible circuit board includes a bent portion facing towards a side surface of the array substrate, and the bent portion includes a bent sub-portion, which is tilted towards the display area along the light-exiting direction of the display device; and at least one light source arranged on the bent sub-portion of the flexible circuit board, and light emitted from the at least one light source is transmitted towards the fingerprint recognition region.

In one aspect, a luminaire is provided for illumination, in which the luminaire has a normalized spectral power distribution (SPD) curve for promoting human wellness, the normalized SPD curve having the following percentage areas for the following wavelength domains, the normalized SPD curve including spectral energy in a 620 nm to 640 nm region of the SPD curve ranging from 9.5% to 10.5% of a total of an area for a normalized SPD curve; spectral energy in a 640 nm to 660 nm region of the SPD curve ranging from 7.25% to 9.8% of the total of the area of the normalized SPD curve; spectral energy in a 660 nm to 680 nm region of the SPD curve ranging from 4.8% to 7.8% of the total of the area for the normalized SPD curve; spectral energy in a 680 nm to 700 nm region of the SPD curve ranging from 2.75% to 5.5% of the total of the area for the normalized SPD curve; and a remainder of spectral energy of the total normalized SPD curve is in a 400 nm to 620 nm region area of the SPD curve.

A display device including a flexible display panel and a roller disposed on a side portion of the flexible display panel to wind the flexible display panel, in which the flexible display panel includes a first substrate including a first base substrate having a display region and a non-display region adjacent to each other, and a light emitting element layer including light emitting elements disposed on the display region, a second substrate including a second base substrate opposing the first base substrate, and a color conversion layer disposed on the second base substrate and corresponding to each light emitting element, and an adhesive filling layer disposed in the display region to form a cell gap between the first and second substrate, and disposed in the non-display region to be in contact with the first and second base substrates to couple and seal the first and second base substrates.

A luminous film has a plurality of light-emitting diodes, a carrier layer and a light-conducting layer having microoptical structures which make it possible to deflect multidirectionally emitted light in a common emission direction of the luminous film, in order to allow uniform illumination of the luminous film surface with a low light-emitting diode population of the luminous film.

A method of manufacturing an augmented LED array assembly is described which comprises providing an LED array assembly configured for inclusion in an LED lighting circuit, the LED array assembly comprising a micro-LED array mounted onto a driver integrated circuit, the driver integrated circuit comprising contact pads configured for electrical connections to a circuit board assembly; providing an essentially planar carrier comprising a plurality of contact bridges, each contact bridge extending between a first contact pad and a second contact pad; and mounting the contact bridge carrier to the LED array assembly by forming solder bonds between the first contact pads of the contact bridge carrier and the contact pads of the driver integrated circuit.

A lighting device includes a substrate having a plurality of flat portions and a non-flat portion disposed between the flat portions, a plurality of light emitting sources disposed on the substrate, a fluorescent substrate layer covering one or more light emitting sources and converting a wavelength of a light from the light emitting source, and a connection line disposed on the substrate and electrically connecting the light emitting sources adjacent to each other between the adjacent light emitting sources. The substrate has a first end and a second end are arranged at different distance from a central axis.

A number of user interface devices are described. In one example, a user interface device includes a lens having a graphic visible through the lens, a transparent circuit film comprising a top surface and a bottom surface, a reflector film bonded to the bottom surface of the transparent circuit film, the reflector film including an embossed area which defines a pocket between the reflector film and the bottom surface of the transparent circuit film, a light emitting diode (LED) bonded to the bottom surface of the transparent circuit film and positioned within the pocket between the reflector film and the bottom surface of the transparent circuit film, and a layer of transparent pressure-sensitive adhesive interposed between the bottom surface of the lens and the top surface of the transparent circuit film.