In an embodiment, a method of manufacturing (100) is described. The method comprises providing (102) a first layer defining a first inner surface (203a) and a first outer surface (203b), a second layer defining a second inner surface (205a) and a second outer surface (205b), and an electrical component (206) positioned on the first inner surface or the second inner surface. The method further comprises attaching (104) the first and second layers together to create a device (200) comprising the first and second layers, wherein the first outer surface and the second outer surface define an external surface of the device. The device further comprises a sealed portion (208) defined by liquid-tight attachment between the first and second inner surfaces. In use of the device, the sealed portion prevents liquid ingress into the device between the first and second layers towards the electrical component.

A display apparatus includes a PCB on which a plurality of LEDs emitting light in a first direction are mounted, a frame configured to support the PCB, and a chassis coupled to the frame. The frame has a length in a second direction perpendicular to the first direction that is longer than that of the PCB.

A light-emitting device includes an insulating base member having thermal conductivity of 10 W/m.Math.K or more; a light-emitting element that has a cathode electrode and an anode electrode and is provided on a front surface side of the base member; a capacitive element that is provided on the base member and supplies an electric current to the light-emitting element; and a reference potential wire that is provided on a rear surface side of the base member and is connected to an external reference potential. The reference potential wire is connected to the capacitive element and is insulated from the cathode electrode and the anode electrode.

A light source module including a ceramic substrate, copper traces, light emitting units, and heat conductive columns is provided. The first heat conductive column and the second heat conductive column correspond to the first light emitting unit and the second light emitting unit respectively. The negative electrode of the first light emitting unit is connected to the first copper trace, the positive electrode of the second light emitting unit is connected to the second copper trace, and the positive electrode of the first light emitting unit and the negative electrode of the second light emitting unit are connected to the third copper trace. An end of the first heat conductive column is connected to the positive electrode of the first light emitting unit, and an end of the second heat conductive column is connected to the negative electrode of the second light emitting unit.

A diagonally cuttable LED strip system comprising of a channel having a bottom and one or more side walls and a lens in which a primary circuit board having one or more LED diodes, one or more resistors, and one or more cutting lines resides therein. The one or more cutting lines include perpendicular and non-perpendicular cutting lines which divide the channel into cuttable increments at one or more angles. An extender is provided which attaches to the end of a channel to allow the cuttable increments of the channel to be extended, shortened, or a combination thereof.

Methods of manufacture are described. A method includes forming a first cavity in a substrate and placing a backplane in the first cavity. At least one layer of dielectric material is formed over the substrate and the backplane. A second cavity is formed in the at least one layer of the dielectric material to expose at least a portion of a surface of the backplane. A heat conductive material is placed in the second cavity and in contact with the at least the portion of the surface of the backplane.

An electronic device is provided, the electronic device includes a driving substrate (13), the driving substrate includes a plurality of circular grooves and a plurality of rectangular grooves, and a plurality of disc-shaped electronic components, at least one disc-shaped electronic component is disposed in at least one circular groove, an alignment element positioned on a top surface of the at least one disc-shaped electronic component, a diameter of the at least one disc-shaped electronic component is defined as R, a diameter of the alignment element is defined as r, a width of at least one rectangular groove among the rectangular grooves is defined as w, and a height of the at least one rectangular groove is defined as H, and the disc-shaped electronic component and the rectangular groove satisfy the condition of (R+r)/2>(w.sup.2+H.sup.2).sup.1/2.

The present disclosure is related to a display device and a circuit board (200). The display device comprises a light-emitting module (100), a circuit board (200) and a conductive structure (300). The surface of the light-emitting module (100) is provided with a conductive portion (101). The circuit board (200) is arranged on a back face (102) of the light-emitting module (100), and has a first surface (201) close to the light-emitting module (100). The first surface (201) of the circuit board (200) is provided with an exposed external conductive layer (210), and the external conductive layer (210) is electrically connected to a ground wire of the circuit board (200). The conductive structure (300) is located between the circuit board (200) and the light-emitting module (100), and makes the external conductive layer (210) electrically connect to the conductive portion (101).

A light source module including a ceramic substrate, copper traces, light emitting units, and heat conductive columns is provided. The first heat conductive column and the second heat conductive column correspond to the first light emitting unit and the second light emitting unit respectively. The negative electrode of the first light emitting unit is connected to the first copper trace, the positive electrode of the second light emitting unit is connected to the second copper trace, and the positive electrode of the first light emitting unit and the negative electrode of the second light emitting unit are connected to the third copper trace. An end of the first heat conductive column is connected to the positive electrode of the first light emitting unit, and an end of the second heat conductive column is connected to the negative electrode of the second light emitting unit.

An LED lamp and a power source module thereof are provided. The power source module includes a switch-type DC-to-DC converter integrated with a function for detecting whether a foreign external impedance exists. The switch-type DC-to-DC converter is configured to enter an installation detection mode when the switch-type DC-to-DC converter is activated. When the switch-type DC-to-DC converter is in the installation detection mode, the switch-type DC-to-DC converter receives an external AC signal received by the LED lamp to detect whether a foreign external impedance exists based on the received signal.