Patent classifications
H05K2201/10113
Illuminated keyboard and backlight module thereof
A backlight module of an illuminated keyboard device includes a circuit board and a plurality of light-emitting elements. The circuit board has a top surface and a bottom surface opposite to the top surface. The top surface has a plurality of key assembling regions. Each of the key assembling regions has a stress release hole defined through the top surface and the bottom surface. The light-emitting elements are respectively disposed on the key assembling regions. Each of the light-emitting elements includes a main body and a conductive portion connected to the main body. The conductive portion is electrically connected to the circuit board, and the stress release hole is adjacent to the conductive portion of each of the light-emitting elements.
Method for manufacturing a non-planar printed circuit board assembly
A method for manufacturing a non-planar printed circuit board assembly (1) is disclosed. The method comprises providing a planar formable substrate (2) for supporting a conductive material (3) and at least one electronic component (4), printing a circuit pattern of an uncured conductive material (3) on the planar substrate (2), forming the substrate (2) and the uncured conductive material (3) into a non-planar shape, and curing the conductive material (3), wherein the substrate (2) comprises a metal sheet and an electrically insulating coating (2b) arranged between the metal sheet and the conductive material (3).
Shading device
A shading device for a greenhouse includes a shading element and at least one lighting element, wherein the shading element comprises an outer side and an inner side. The shading element is formed from interwoven electrically conductive first thread elements and electrically insulating second thread elements. The first and/or second thread elements each may be adapted for reflecting an ambient light. The lighting element(s) may be arranged at the inner side of the shading element and connected with the first thread elements, and the lighting element(s) may be driven by an electrical current, conducted by the first thread elements, resulting in the emission of an artificial light, which may illuminate a plant growing in the greenhouse.
Apparatus for Assembling Light-Emitting Diode Lighting Fixtures
An apparatus for assembling a LED lighting fixture contains a power cable, an elongated coupler, a base plate, a protruding terminal, a receiving terminal, and a lighting assembly. The power cable is terminally fixed to a distal end of the elongated coupler. On the other hand, the receiving terminal is integrated into a proximal end of the elongated coupler. When the base plate, which contains the lighting assembly, needs to be attached, the protruding terminal is removably positioned into the receiving terminal. As a result, the current path from the elongated coupler to the lighting assembly is completed. The ability to conveniently detach the base plate allows the user to use different lighting assemblies as preferred. If the exterior appearance of the apparatus needs to change, a fixture housing is used.
Method of mounting self-adhesive substrate on electronic device
A method of mounting a self-adhesive substrate on an electronic device comprising steps of: (S01) providing a base for mounting at least one self-adhesive substrate thereon, wherein each self-adhesive substrate includes a copper circuit layer formed thereon, an insulated adhering layer adhered with the copper circuit layer and made of glue with thermal conductive powders, and a release layer attached with the insulated adhering layer; (S02) forming the at least one self-adhesive substrate on the base based on a profile or a circuit configuration of a fixing portion of an accommodating member of an electronic device; (S03) welding a plurality of electronic elements on the copper circuit layer of each self-adhesive substrate; (S04) removing each self-adhesive substrate; (S05) removing the release layer from each self-adhesive substrate to adhere each self-adhesive substrate on the fixing portion of the accommodating member of the electronic device.
CONNECTOR, CIRCUIT BOARD MODULE AND CIRCUIT BOARD MODULE ARRAY INCLUDING SAME
In one embodiment, provided is a connector comprising: a body; a first protrusion formed on a first surface of the body; a first groove formed on the first surface of the body to be adjacent to the first protrusion, and of which the shape includes the inverse of the first protrusion; a first terminal of which at least a portion is arranged to correspond to the first protrusion; and a second terminal of which at least a portion is arranged to correspond to the first groove.
SHAPED SUBSTRATE WITH ARRANGEMENT OF SOLID STATE LIGHT SOURCES
A substrate for a solid state lighting module has a plurality of serrated finger sections extending from an interconnecting base. The substrate may be formed from a single rectangular sheet by cutting away material between adjacent finger sections of a symmetrical second substrate to form the finger sections of the substrate. Parallel linear rows of solid state light sources may be disposed along the length of each finger section. For example, the solid state light sources may be disposed proximate to points of sawteeth at the edges of the finger sections.
LED lead frame for laminated LED circuits
Techniques are disclosed for integrating the LED lead frame into the LED circuit fabrication process. The LED packages within the lead frame may be spaced according to the final spacing of the LED packages on the finished circuit board, such that multiple LED packages may be attached to a circuit board at a time by applying the lead frame to circuit board and then removing portions of the lead frame, leaving the LED packages attached to the board. The LED packages may be attached using solder or conductive epoxy, in some embodiments. Alternatively, part of the lead frame may include conductive wires forming one or more strings of LED packages. An entire string of LED packages may then be removed from the lead frame in a single motion and placement may be performed for a string of LED packages all at once rather than for individual LED packages.
STRUCTURE AND METHOD FOR FAILURE DIAGNOSIS OF PCB BOARD FOR ARTICLE TRANSPORT ELEVATOR
The present invention relates to a structure and method for failure diagnosis of a PCB board for article transport elevator installed and used in a multi-layer structural restaurant, factories or other business establishments. More particularly, the article transport elevator is configured such that circuit units of the PCB board are connected with lamps that turn on in accordance with whether each functional part is operated normally or not, thereby looking at the PCB board and collectively diagnosing the presence or absence of a failure of the power supply unit, the seesaw switch unit of each layer, the car arrival limit unit, the car operation condition unit and the car operation state unit in accordance with the turn-on/off operation of each lamp in a simple and quick manner, especially easily and quickly diagnosing the failure even by beginners, finally excellently providing convenience in failure diagnosis.
Recyclable electronic device
An electronic device is described that is designed to be more easily recycled at its end of life while maintaining usability during its lifetime. The electronic device includes a first substrate, an encapsulation layer, and a set of electronics disposed there between. One or more delamination layers cover at least one side, preferably both sides, of the set of electronics to separate the set of electronics from at least one, preferably both, of the first substrate and the encapsulation layer. The set of electronics, covered by the one or more delamination layers, is encapsulated between the encapsulation layer and the first substrate. At least one of the delamination layers includes a set of passages filled with material of the encapsulation layer forming a set of interconnections between the encapsulation layer and the first substrate.