A power supply apparatus is provided. The power supply apparatus includes a flexible board including a first surface and a second surface disposed opposite to the first surface, a connecting terminal disposed on the first surface of the flexible board, and a fixing plate disposed on the second surface of the flexible board and disposed opposite to the connecting terminal.

An integrated module includes a printed circuit board body and a printed circuit board convex portion. The printed circuit board convex portion is arranged on one side of a width extension direction of the printed circuit board body. A second function module with larger volume is arranged on the printed circuit board convex portion, and a first function module with smaller volume is arranged on the printed circuit board body, so that the width of the printed circuit board body may be made smaller, and the width of the printed circuit board body may be made less than 8.50.1 mm, thereby realizing the low profile effect during the assembly of the integrated module and avoiding the abrupt conflict of the entire intelligent device caused by the assembly of the integrated module due to the excessive width of the integrated module.