A flexible light emitting diode (LED) circuit having a first layer, the first layer including a conductive material configured to connect to an LED die, a second layer, the second layer including an electrically insulating material, and a third layer positioned between the first and second layer, the third layer having a first terminal extended electrically connecting tab that extends outward beyond the first layer and the second layer.

A device comprising a first and a second electrically conductive textile portion is provided, wherein the first and second textile portions are electrically isolated from each other. The device also comprises an electrical element having a first contact pad which is electrically connected to the first textile portion and a second contact pad which is electrically connected to the second textile portion, wherein the first and second textile portions are adapted to supply the electrical element with electrical power. An improved textile device is thereby provided, which is capable of supplying an electrical element with electrical power.

Flexible interconnection between substrates, where the substrates include one or more solid state light sources, mounted at varying angles are provided. A multi-dimensional lighting device is formed using such substrates. The multi-dimensional lighting device includes external mounting surfaces, each configured to provide mounting positions for one or more substrates. A flexible jumper device electrically couples a given substrate to an adjacent substrate, and provides a predefined clearance between surfaces of the same and exposed conductive surfaces of the lighting device. Each flexible jumper includes a surface mount device (SMD) capable of being placed by automated process, such as by pick-and-place machines. Such lighting devices are thus possible using automated processes in a high-volume, highly-precise manner.

This specification relates to a lighting apparatus, including a support and three or more surface light source panels provided on the support. The surface light source panel has two or more types of light-emitting colors.

A flexible copper-clad laminate for a vehicle LED lamp is provided and includes a copper-clad layer and a composite layer that are laminated. The composite layer includes a polyimide layer and thermoplastic polyimide layers. An outermost layer of the composite layer is formed as a thermoplastic polyimide layer. A total thickness of the thermoplastic polyimide layers and an entire thickness of the polyimide layer with respect to a total thickness of the composite layer is about 10 to 50% and 50 to 90%, respectively. The total thickness of the thermoplastic polyimide layers and the entire thickness of the polyimide layer with respect to the thickness of the composite layer is about 20 to 40% and 60 to 80%, respectively. A thickness of the copper-clad layer is about 30 to 80 μm, and the total thickness of the composite layer is about 10 to 15 μm.

A flexible light emitting diode (LED) circuit having a first layer, the first layer including a conductive material configured to connect to an LED die, a second layer, the second layer including an electrically insulating material, and a third layer positioned between the first and second layer, the third layer having a first terminal extended electrically connecting tab that extends outward beyond the first layer and the second layer.

An illumination device comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure. The holder comprises a heat dissipating base body and a carrying unit. The carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body. The plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern.

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

A housing for a luminaire or an operating device for the luminaire, wherein the housing is configured to accommodate at least one electronic component and/or a light source, and comprising a conductive housing component (2). The housing includes at least one line (1, 1′, 1″, 1′″, 1″″) for transmitting electric high frequency signals or for transmitting and/or receiving radio waves. The transmission line is formed by arranging a dielectric layer (4, 4a, 4b, 9) and a conductor (3, 3 . . . 3c, 7) on the housing component (2) such that the conductive housing component (2) serves as a reference plane, and the conductive housing component (2) and the conductor (3, 3 . . . 3c, 7) sandwich the dielectric layer (4, 4a, 4b, 9).

An optoelectronically functional multilayer structure as well as related methods of manufacturing an optoelectronically functional multilayer structure are described herein.