A lighting memory device and a memory module are provided. A lighting control circuit receives at least one lighting mode selection signal through lighting mode control pins and controls luminous characteristics of a plurality of light sources according to a lighting control mode corresponding to the lighting mode selection signal.

Disclosed is a wireless charger. The wireless charger includes a circuit board, a base and two transmitting coils. The circuit board is disposed in the base, a placement panel is disposed on the base, and two placement areas are disposed on the placement panel to carry two induction devices each provided with an induction coil or an induction metal. Two transmitting coils are disposed corresponding to the two placement areas in the base. Each transmitting coil is located below a respective one of the two placement area and electrically connected to the circuit board. The transmitting coil is capable of generating a magnetic field to enable electromagnetic induction with a respective one of the two induction devices so as to charge or heat the respective one of the two induction devices.

The present disclosure provides a PCB board, a manufacturing method of a PCB board, and an electrical device, where the PCB board includes an insulating dielectric layer which is a glass substrate layer including a top surface and a bottom surface disposed oppositely; a conductive wiring layer which is disposed on a top surface of the insulating dielectric layer; and a top ink layer which is coated on the conductive wiring layer. According to the technical solution provided by the embodiment of the disclosure, the PCB board does not generate the phenomenon of deformation warping, and the conductive wiring layer is not easily peeled off from the insulating medium layer, and the use performance of the PCB board is good.

The present disclosure provides a circuit board assembly, a TOF camera module including the circuit board assembly and applications thereof. The circuit board assembly is used to support an electronic component, and includes a conductive portion and an insulating portion. The insulating portion is integrally bonded to the conductive portion, and the conductive portion extends through the insulating portion. The electronic component is supported by the conductive portion and is communicated with the conductive portion, so that the electronic component directly dissipates heat through the conductive portion during operation.

A flexible light emitting diode (LED) circuit having a first layer, the first layer including a conductive material configured to connect to an LED die, a second layer, the second layer including an electrically insulating material, and a third layer positioned between the first and second layer, the third layer having a first terminal extended electrically connecting tab that extends outward beyond the first layer and the second layer.

The invention relates to a circuit board (1), preferably for a circuit for operating a lighting means, comprising a retaining bow (2), which is arranged on a planar top side (11) of the circuit board (1) and mechanically connected to the circuit board (1); and comprising a through-bore (3), which is arranged at least partially below the retaining bow (2); wherein the through-bore (3) has at least one taper (31) and wherein a housing (5) for protecting the circuit board (1) can be mechanically fastened by means of the retaining bow (2) and the taper (31). The retaining bow (2) is arranged on the circuit board (1) by means of a solder joint (32). The invention further relates to a system for a circuit for operating a lighting means and to a method for fastening a housing (5) to a circuit board (1).

A polyhedron type display device includes: a plurality of liquid crystal panels connected to each other to constitute a polyhedral shape; a light source housing at a center of mass of the polyhedral shape; a light source unit accommodated in the light source housing, the light source unit emitting a light to supply the light to the plurality of liquid crystal panels; a light source supporting pillar connecting and supporting the light source housing and the plurality of liquid crystal panels; a structure supporting pedestal supporting the light source supporting pillar; a supporting panel supporting the plurality of liquid crystal panels; a radiating pillar connected to the light source unit and emitting a heat of the light source unit; and a protecting cover covering and protecting the radiating pillar.

The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements arranged on the first surface, and a first adhesive layer arranged on the first support structure. Each light-emitting element has a side wall, a bottom surface, a first electrode pad, and a second electrode pad arranged on the bottom surface. The first adhesive layer surrounds the side wall and does not directly contact the bottom surface. The first support structure includes a plurality of through holes located on positions corresponding to the first electrode pad and the second electrode pad.

The invention relates to an electronic module (40) comprising at least one printed circuit board of a first type (referred to as printed circuit board A), which is equipped in an overlapping manner with at least one printed circuit board of a second type (referred to as printed circuit hoard B), printed circuit board B being equipped with at least one electronic component with specific requirements (19), mid the interconnected printed circuit boards A and B forming a stepped composite printed circuit board (100, 200, 300, 400, 300). The composite primed circuit board (100, 200, 300, 400, 500) is delimited at least in some regions by end regions (16) which are formed by sections of the at least one printed circuit board A, and the composite printed circuit board (100, 200, 300, 400, 500) is placed on a heat sink (20). A fastening side (15) of the at least one printed circuit board B rests flat on a contact face (21) of the heat sink (20), the contact face (21) of the heat sink (20) being dimensioned and positioned such that at least part of a extends laterally beyond the fastening side (15) of the at least one printed circuit board B in each case towards the end regions (10) formed. Supporting elements (23, 24, 23, 26) are formed on the contact face (21) of the treat sink for the mechanical support of the end regions (16). The invention also relates to a method for producing such an electronic module.

An electronic assembly and a method of forming an electronic assembly. The electronic assembly including a printed circuit board including a first face, a flexible printed circuit connected to the first face of the printed circuit board, a filler component arranged over a first portion of the first face of the printed circuit board, a housing defining a cavity, wherein the filler component is arranged in the cavity, a channel guide extending from the housing, wherein the flexible printed circuit sits in the channel guide, and a substrate positioned adjacent to a second face of the printed circuit board, wherein the second face opposes the first face.