Patent classifications
H05K2201/10121
Capsule core and capsule endoscope
A capsule core and a capsule endoscope are provided. The capsule core includes a printed circuit board module, connecting structures and functional units. The printed circuit board module includes more than more printed circuit boards connected through flexible circuit boards and spaced apart. The connecting structures connect adjacent printed circuit boards. The functional units are mounted on the printed circuit boards or the connecting structures, and at least part of the functional units communicates with the printed circuit boards.
Driving system
A driving system for moving several optical elements is provided, including a first module, a second module and a third module. The first, second and third modules respectively have a first, second and third terminal electrically connected an external circuit. The first terminal is on a first side of the first module, the second terminal is on a second side of the second module, and the third terminal is on a third side of the third module. Specifically, the first, second, and third terminals are located on the same side of the driving system.
Vaporizer device body
Features relating to a vaporizer body are provided. The vaporizer body may include an outer shell that includes an inner region defined by an outer shell sidewall. A support structure is configured to fit within the inner region of the outer shell. The support structure includes a storage region defined by a top support structure, a bottom support structure, a bottom cap, and a gasket. An integrated board assembly is configured to fit within the storage region of the support structure. The integrated board assembly may include a printed circuit board assembly formed of multiple layers that form a rigid structure and that include an inner, flexible layer. A first antenna is integrated at a proximal end of the flexible layer, and a second antenna is integrated at a distal end of the flexible layer.
Autolacing footwear motor having rotary drum encoder
An article of footwear, method, and motorized lacing system includes a motor, including a motor shaft, a spool, coupled to the motor shaft, configured to spool and unspool the lace based on the turning of the motor shaft, a processor circuit, and a three-dimensional encoder. The three-dimensional encoder defines a major axis and has a surface having a tabs extending from a drum, an optical sensor, positioned within optical range of the cylindrical encoder, configured to output a signal to the processor circuit indicative of a detected one of the tabs, and a beam break, positioned between the three-dimensional encoder and the optical sensor, forming a pair of slits. The optical sensor is positioned to view the tabs through the pair of slits, wherein the processor circuit is configured to operate the motor based, at least in part, on the signal as received from the optical sensor.
Luminous film having microoptical structure
A luminous film has a plurality of light-emitting diodes, a carrier layer and a light-conducting layer having microoptical structures which make it possible to deflect multidirectionally emitted light in a common emission direction of the luminous film, in order to allow uniform illumination of the luminous film surface with a low light-emitting diode population of the luminous film.
BACKLIT USER INTERFACE
A number of user interface devices are described. In one example, a user interface device includes a lens having a graphic visible through the lens, a transparent circuit film comprising a top surface and a bottom surface, a reflector film bonded to the bottom surface of the transparent circuit film, the reflector film including an embossed area which defines a pocket between the reflector film and the bottom surface of the transparent circuit film, a light emitting diode (LED) bonded to the bottom surface of the transparent circuit film and positioned within the pocket between the reflector film and the bottom surface of the transparent circuit film, and a layer of transparent pressure-sensitive adhesive interposed between the bottom surface of the lens and the top surface of the transparent circuit film.
CIRCUIT BOARD CONNECTOR FOR A CIRCUIT BOARD
A connector for a circuit board includes a connector housing having a mounting arm. The mounting arm has a first fastening element that is releasably connectable to a first connecting element on the circuit board. The connection between the first fastening element and the first connecting element can be established and/or released by deflecting the mounting arm. A securing unit is disposed on the connector housing in such a way that the securing unit is movable between a releasing position and a locking position. In the locking position, the securing unit blocks deflection of the mounting arm. In the releasing position, the securing unit enables deflection of the mounting arm.
OPTO-ELECTRIC HYBRID BOARD
An opto-electric hybrid board includes an optical waveguide, and an electric circuit board disposed on a one-side surface in the thickness direction of the optical waveguide. The electric circuit board includes a first terminal on which an optical element portion is mounted and a second terminal on which a driver element portion is mounted. The electric circuit board includes a metal supporting layer that overlaps the first terminal and the second terminal when the electric circuit board is projected in the thickness direction. The metal supporting layer has an opening portion that is located between the first terminal and the second terminal when the metal supporting layer is projected in the thickness direction.
Optical module
This application provides an optical module, and relates to the field of optical communication. An optical module provided in the embodiments of this application includes a laser box and a silicon photonic chip that are enclosed and packaged by an upper enclosure part and a lower enclosure part. The laser box is disposed on and is in contact with the surface of the silicon photonic chip by the side wall or the base. The laser chip is disposed on the top plane of the laser box. The top plane is in contact with the upper enclosure part for heat dissipation, so as to help heat generated by the laser chip be conducted to the upper enclosure part via the top plane, so that the heat generated by the laser chip is dissipated not via the silicon photonic chip.
PORTABLE ELECTRONIC DEVICE AND IMAGE-CAPTURING MODULE THEREOF
A portable electronic device and an image-capturing module thereof are provided. The image-capturing module includes a circuit substrate, an image sensing chip, a rigidity reinforcing structure, and a lens assembly. The circuit substrate has a plurality of conductive substrate contacts. The image sensing chip is disposed on the circuit substrate and electrically connected to the circuit substrate. The image sensing chip includes an image sensing region, and a plurality of conductive chip contacts respectively and electrically connected to the conductive substrate contacts. The rigidity reinforcing structure is disposed on the circuit substrate. The lens assembly includes a lens holder and a lens structure disposed on the lens holder, and the lens structure corresponds to the image sensing region. A perpendicular projection of each of the conductive substrate contacts and a perpendicular projection of each of the conductive chip contacts can be shown on the rigidity reinforcing structure.