The present disclosure provides a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

A substrate for an image sensor according to an embodiment includes an insulating layer; and a conductive pattern portion disposed on the insulating layer, wherein the insulating layer comprises: a first insulating part; and a second insulating part surrounding the first insulating part and spaced apart from the first insulating part with an open region therebetween, wherein the conductive pattern portion comprises a first lead pattern part disposed on the first insulating part; a second lead pattern part disposed on the second insulating part; and an extension pattern part disposed on the open region of the insulating layer to connect the first lead pattern part with the second lead pattern part and including a bent portion.

Research on practical realization of various types of printable devices has progressed, and the realization of devices in which these printable devices are integrated on a flexible board is expected. However, there is the problem that, if a plurality of printable devices are simply integrated on the same board, the area of the integrated device increases, and the yield ratio greatly decreases. An integration technique that solves the problem of an increase in the area and a decrease in the yield ratio is in demand. Electronic devices to be integrated are formed on individual boards, the boards are laid to overlap each other in a predetermined relationship, and then through-vias are formed at predetermined positions. With this, the electronic devices are electrically connected to each other, and function as an integrated device.

An optical module is provided in the present disclosure. According to an embodiment, the optical module may comprise a housing, two or more circuit board layers, and a light emitting chip. The two or more circuit board layers may be disposed in the housing and electrically connected to each other; and the light emitting chip may be electrically connected to at least one of the circuit board layers.

An optical module includes: a stem made of metal; a ground pin including a pin portion and a joint portion having a diameter larger than a diameter of the pin portion and joined to an outer flat surface of the stem; a flexible printed circuit including a wiring pattern on a front surface and a ground pattern having an exposed surface at a position facing the outer flat surface of the stem on a back surface, in which a tip portion of the pin portion of the ground pin penetrating a second through hole is electrically connected to the second through hole on the front surface; and a plate made of metal, having a back surface joined to the outer flat surface of the stem and a front surface joined to the exposed surface of the ground pattern.

Examples are disclosed herein that relate to linear magnetic actuators in camera devices. One example provides a camera device comprising an optical sensor, a lens positioned a variable distance away from the optical sensor, a linear magnetic actuator having a coil and a magnet configured for linear relative movement upon driving of current, and an actuator coupling structure. The actuator coupling structure couples the linear magnetic actuator to the lens, such that the lens moves in response to the movement of the linear actuator.

A wiring board includes: an insulating member having a first upper surface, and a second upper surface located higher than the first upper surface; and a first wiring layer located on the first upper surface. The first upper surface has a wiring region that does not overlap with the second upper surface in a top view, and that is located in an exposed region. The first wiring layer extends from the wiring region to a connecting region that is connected to the wiring region, that overlaps with the second upper surface in a top view, and that is not exposed. The first wiring layer comprises a first pad portion located in the wiring region, and a first pattern portion located in the connecting region.

A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member.

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.

Embodiments are generally directed apparatuses, methods, techniques and so forth to select two or more processing units of the plurality of processing units to process a workload, and configure a circuit switch to link the two or more processing units to process the workload, the two or more processing units each linked to each other via paths of communication and the circuit switch.