Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

A manufacturing method of a multilayered board, includes: a dot pattern forming process that forms a dot pattern comprising at least one hemispherical micro-lens shape by repeating a process of forming one hemispherical micro-lens shape by jetting one droplet for forming the dot pattern in an inkjet manner; and a stack pattern forming process that forms a stack pattern having a thickness less than that of the micro-lens by jetting a droplet for forming the stack pattern on a predetermined area around the dot pattern in the inkjet manner.

An electric lock includes a housing, a keypad module and a lock assembly. The keypad module is arranged on the housing. The keypad module includes a key panel, an electrode pad, a circuit board and a spacer. The key panel is marked with a plurality of key characters. The electrode pad is arranged on an inner side of the key panel, and the electrode pad has a plurality of key electrodes corresponding to the plurality of key characters respectively. The circuit board includes a plurality of key circuits. Each of the key circuits is configured to generate a key signal when contacting a corresponding key electrode. The spacer is configured to form a gap between each of the key circuits and the corresponding key electrode. The lock assembly is electrically connected to the keypad module for performing locking and unlocking operations according to the key signal.

A MEMS board assembly, a LiDAR system including the same, and a method for making the same are disclosed. The exemplary MEMS board assembly includes a MEMS board having a plurality of through holes and a mount having a plurality of threaded holes. The MEMS board assembly further includes a plurality of spring-loaded posts each formed by fitting a spring into a respective post. The plurality of spring-loaded posts are fitted into the plurality of threaded holes of the mount. The MEMS board assembly also includes a plurality of screws fitting the MEMS board to the mount by reaching into the plurality of threaded holes of the mount through the plurality of through holes in the MEMS board and the plurality of spring-loaded posts. The MEMS board touches the plurality of spring-loaded posts at the plurality of through holes in the MEMS board corresponding to the plurality of threaded holes of the mount respectively.

An opto-electric composite transmission module includes an opto-electric hybrid board, a printed wiring board, an opto-electric conversion portion, a first heat transfer member, and a case made of metal. The opto-electric hybrid board, the opto-electric conversion portion, the first heat transfer member, and a first wall of the case are disposed in order toward one side in a thickness direction. The printed wiring board integrally has a first portion and a second portion spaced apart from each other, and a connecting portion for connecting these when viewed from the top. The first portion, the second portion, and the connecting portion include a first overlapped region. The first overlapped region is overlapped with the opto-electric hybrid board without being overlapped with the opto-electric conversion portion when projected in the thickness direction. The first overlapped region is overlapped with the opto-electric conversion portion when projected in a plane direction.

A circuit board utilizing the better and faster performance of optical signals includes interconnected first, second, and third areas. The first area includes a first circuit substrate, and a first coupling element and a chip connected thereon. The second area includes an optical fiber within an insulating layer. The third area includes a second circuit substrate, and a second coupling element and an electronic element connected thereon. The first coupling element and the second coupling element are optically aligned with the optical fiber for signal reception and transmission. A method for manufacturing such composite circuit board is also disclosed.

A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The circuit board has a chip-receiving slot recessed in the surface thereof The sensor chip is arranged in the chip-receiving slot, and a top surface of the sensor chip and the surface of the circuit board have a step difference therebetween that is less than or equal to 10 μm. The supporting adhesive layer is in a ringed shape and is disposed on the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the surface of the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, a light-permeable sheet, and a top shielding layer. The circuit board has no slot recessed in the surface thereof. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip. The top shielding layer is formed on an outer surface of the light-permeable sheet and has an opening that is located above a sensing region of the sensor chip.

A photonic device includes a PCB having an integrated circuit mounted thereon, with a cap mounted to the PCB and carrying a lens positioned over the integrated circuit. The cap is formed by: an outer wall mounted to the PCB, extending upwardly from the PCB, and surrounding a portion of the integrated circuit; a first retention structure extending inwardly from the outer wall and across the integrated circuit, the first retention structure having a hole defined therein; and a second retention structure having a hole defined therein, the second retention structure being affixed within the first retention structure such that the hole in the second retention structure is axially aligned with the hole in the first retention structure. The lens is mechanically constrained within the cap between the first retention structure and the second retention structure.