H05K2201/10128

ANTENNA PACKAGE AND IMAGE DISPLAY DEVICE INCLUDING THE SAME
20230092067 · 2023-03-23 ·

An antenna package according to an embodiment includes an antenna unit and a circuit board bonded to the antenna unit. The circuit board includes a core layer comprising a plurality of portions having different widths from each other in a planar view, the core layer having a first surface and a second surface opposing each other, and a circuit wiring disposed on the first surface of the core layer and electrically connected to the antenna unit.

ELECTRONIC DEVICE
20230092816 · 2023-03-23 ·

An electronic device with high density for component arrangement includes a first substrate, a second substrate, a plural of passages formed through the first and the second substrates, a first contact arranged on the first face of the first substrate to conceal the corresponding one of the passages, a second contact arranged on the second substrate and adjacent to the corresponding one of the passages, and a conductor disposed in the passages. A first end of the conductor electrically connects the first contact, while a second end of the conductor electrically connects the second contact.

FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE COMPRISING THE SAME
20230086816 · 2023-03-23 ·

A flexible printed circuit board according to an embodiment includes: a substrate; a circuit pattern disposed on the substrate; and a protective layer on the circuit pattern, wherein the circuit pattern includes a first circuit pattern and a second circuit pattern connected to a chip in a chip mounting region, a first direction that is a direction in which the circuit pattern extends and a second direction perpendicular to the first direction are defined in the substrate, the substrate includes first and second ends facing each other in the first direction and third and fourth ends facing each other in the second direction, the protective layer includes fifth and sixth ends spaced apart from ends of the substrate and facing in the first direction and seventh and eighth ends spaced apart from ends of the substrate and facing in the second direction, and an outer pattern disposed adjacent to the third end and the fourth end on the substrate, wherein the outer pattern includes: a first outer pattern and a second outer pattern adjacent to a pad portion of the first circuit pattern and facing in the second direction; and a third outer pattern and a fourth outer pattern adjacent to a pad portion of the second circuit pattern and facing in the second direction, the first outer pattern includes a first pattern portion and a second pattern portion spaced apart from each other, the second outer pattern includes a third pattern portion and a fourth pattern portion spaced apart from each other, the third outer pattern includes a fifth pattern portion and a sixth pattern portion spaced apart from each other, the fourth outer pattern includes a seventh pattern portion and an eighth pattern portion spaced apart from each other, and a fifth end of the protective layer is disposed between the first pattern portion and the second pattern portion and between the third pattern portion and the fourth pattern portion.

FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
20220346224 · 2022-10-27 ·

A flexible printed circuit board (FPCB) of an electronic device including a flexible display having a shape deformed by a hinge structure is provided. The FPCB of an electronic device includes a plurality of bending portions and a plurality of non-bending portions. The plurality of bending portions is bent according to a deformation of a shape of the electronic device. The plurality of non-bending portions are positioned on a periphery of the plurality of bending portions. The plurality of bending portions and the plurality of non-bending portions are formed to have different thicknesses.

ELECTRONIC DEVICE INCLUDING FLEXIBLE SUBSTRATE

An electronic device includes: a housing including a plate and a back plate facing a second surface of the plate and including a planar area facing a first direction, a display module including a display disposed on a first surface of the plate, a battery and a circuit board disposed on the second surface of the plate, a first flexible substrate extending from the display module, and a second flexible substrate extending from the circuit board to the first flexible substrate across the battery. The first flexible substrate includes a first connector, and the second flexible substrate includes a second connector. The first flexible substrate and the second flexible substrate are configured such that the first connector and the second connector are coupled in a second direction different from the first direction.

FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, TOUCH PANEL AND MANUFACTURING METHOD THEREOF
20220342498 · 2022-10-27 ·

A flexible circuit board has a first binding area and a bending area. The flexible circuit board includes a flexible substrate, a conductor layer, a first protective layer, and a plurality of first binding pins. The plurality of first binding pins is arranged in the first binding area on the flexible substrate. The orthographic projection on the flexible substrate of an edge line of each first binding pin is located within the edge of the flexible substrate, wherein the edge line is located at an end along the extension direction of the first binding pin. The conductor layer is arranged in the bending area on the flexible substrate. The conductor layer is connected with the first binding pins. The first protective layer is arranged on the side of the conductor layer away from the flexible substrate.

Display panel and terminal device
11612059 · 2023-03-21 · ·

The present disclosure relates to a display panel and a terminal device. The display panel can include a display screen, a flexible circuit board, and a control chip. The display screen can further include a main display portion and a bent portion extending from an edge of the main display portion. The bent portion is bent towards a lower side of the main display portion. The flexible circuit board is connected to an end of the bent portion away from the main display portion and extends to below the main display portion. The control chip is mounted on the flexible circuit board.

Display device

The present disclosure relates to the technical field of display, and discloses a display device. The display device includes: a display module having a module body and a first bonding portion located on one side of a first long edge of the module body, where the first bonding portion is bent to the back face of the module body; and a first flexible printed circuit located on the back face of the module body, where the first flexible printed circuit has a second bonding portion, and the second bonding portion is fixedly connected to the first bonding portion of the display module; the length of the second bonding portion along an extending direction of the first long edge is substantially identical with the length of the first bonding portion along the extending direction of the first long edge.

METHOD FOR MANUFACTURING A DISPLAY DEVICE

A method for manufacturing a display device includes providing a first display device assembly comprising a display module, a first window disposed on the display module, a first window adhesive layer disposed between the display module and the first window, and a first protective layer disposed on the first window. The first protective layer is removed. The first window is removed by providing an acid solution on the first display device assembly. A second window is provided that is disposed on the display module after the first window is removed. A second protective layer is provided that is disposed on the second window after the first protective layer is removed.

Circuit board and display device including the same

A circuit board for a display device includes: a signal line to transmit signal, a first metallic layer overlapping the signal line, a first conductive layer spaced apart from the first metallic layer, a base layer insulating the signal line from the first metallic layer and from the first conductive layer, and a first capacitor including a first terminal electrically coupled to the first metallic layer and a second terminal electrically coupled to the first conductive layer.