The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes an output driver circuit, a low drop out (LDO) regulator circuit, and an over-voltage protection circuit with improved capacity and response time.

A strain gauge includes: a flexible substrate; a resistor formed on one side of the substrate; a pair of terminal parts electrically connected to both ends of the resistor; and a plurality of resistance value tuning wires configured to tune the resistance value between the pair of terminal parts. In this strain gauge, the plan shape of the resistor is a spiral shape formed by two linear resistance wires about the halfway part of the two linear resistance wires, the two linear resistance wires being a predetermined space apart from each other and extending in the same direction from the halfway part, and the resistance value tuning wires are arranged discretely so as to bridge between the two linear resistance wires.

Electrical components may have plastic packages. Contacts may be formed on exterior surfaces of the plastic packages. A plastic package for an electrical component may have an elongated shape that extends along a longitudinal axis. A first groove may run parallel to the longitudinal axis on a lower surface of the plastic package. A second groove may run perpendicular to the first groove on an opposing upper surface of the plastic package. The electrical components may be coupled to fibers in a fabric such as a woven fabric. A first solder connection may be formed between the first groove and a first fiber such as a weft fiber. A second solder connection may be formed between the second groove and a second fiber such as a warp fiber.

A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.

A flexible, multi-layered device for automatically sensing sweat biomarkers, storing and transmitting sensed data via wireless network to a computing device having software applications operable thereon for receiving and analyzing the sensed data. The device is functional in extreme conditions, including extremely hot temperatures, extremely cold temperatures, high salinity, high altitude, extreme pHs, and/or extreme pressures.

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.

An endoscope device and a cable assembly thereof are provided. The cable assembly includes a first substrate, a second substrate, and a wire. The first substrate includes a first body and a first solder pad disposed on the first body. The second substrate is correspondingly disposed on the first substrate and includes a second body, a second solder pad disposed on the second body and corresponding to the first solder pad, and an accommodating portion corresponding to the second solder pad. The wire includes a soldering portion disposed in the accommodating portion. The first solder pad and the second solder pad are coupled to each other by at least one of a first solder and a second solder, and the soldering portion and the second solder pad are coupled to each other by the first solder.

A flexible wiring board includes a signal line and a conductive portion that overlaps the signal line in plan view. The conductive portion includes a first line portion extending in a first direction and having a first part and a second part, a second line portion extending in a second direction and having a third part and a fourth part, and a third line portion. The third line portion has a line width smaller than a line width of the first part and a line width of the second part, is connected to the first and second parts, and is provided between the first part and the second part. The conductive portion includes a fourth line portion that is connected to the third part and the fourth part and that is provided between the third part and the fourth part. The third line portion and the fourth line portion intersect.

In some examples, an electronic device includes a printed circuit board. In some examples, the printed circuit board includes a conductive base layer. In some examples, the conductive base layer is an electrode to produce a signal indicative of a change in an omnidirectional electrostatic field corresponding to a moving object. In some examples, the printed circuit board includes a via coupled to the conductive base layer. In some examples, the via is disposed through an intermediate layer of the printed circuit board. In some examples, the printed circuit board includes an integrated circuit coupled to the via. In some examples, the integrated circuit is to detect, using a machine learning model, a direction of the moving object in the omnidirectional electrostatic field based on a feature of the signal.

The present invention relates to an embedded printed circuit board including: an insulation substrate including a cavity; a sensor device disposed on the cavity; an insulating layer disposed on the insulation substrate, having an opening part exposing the sensor device; and a pad part disposed on the lower surface of the opening part exposing the sensor device.