A jig includes a base and one or more movable blocks. The base has an upper surface, which is configured to receive a substrate shaped as a flattened polyhedron having multiple facets. The one or more movable blocks are configured to move on the base so as to fold respective ones of the multiple facets, and to hold the substrate in a folded three-dimensional configuration.

A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.

A camera module comprising: a housing; a lens assembly that is fixed to the housing and comprises at least one lens; a circuit board that is arranged inside the housing and comprises a first circuit board and a second circuit board, on which image sensors arranged to face the lens are mounted, respectively; and a first shield can arranged inside the housing so as to support edges of the first and second circuit boards.

Laboratory on chip and its layered manufacturing method, wherein the method includes: designing, by means of a computer program, a printed circuit (7), mixing and reaction cavities (3) of fluids, microchannels (2) and spaces (15) for the placement of electronic components to be found in each layer, mechanizing in one or more biocompatible substrates the different voids and passages that will make up the mixing and reaction cavities (3), microchannels (2), holes (8) that join the microchannels and spaces for the subsequent placement of electronic components (15), metallizing with a biocompatible conductive material those surfaces in which the printed circuit will be integrated (7) according to the design performed in the first step, generating the printed circuit (7) by photolithography and acid attack, bonding the electronic components in the corresponding spaces (15), joining all the layers that make up the final laboratory.

The present disclosure relates to an electronic device (10) comprising at least one electrically conductive structure (11) with a tubular shape having outer and inner surfaces (11c, 11d) covered by an insulating layer (12), and one or more integrated circuits (13) positioned within the electrically conductive structure (11).

Glucose monitoring devices and related systems and methods, the glucose monitoring devices including a sensor electronics unit having a housing and a printed circuit board disposed within the housing, a transcutaneous glucose sensor assembly, and a conductive sensor connector. The printed circuit board includes a first electrical contact, the transcutaneous glucose sensor assembly includes a distal portion having a working electrode and proximal portion having a working-electrode contact in electrical communication with the working electrode, and the conductive sensor connector electrically connects the working-electrode contact with the first electrical contact. Further, the conductive sensor connector extends through a hole in the proximal portion of the transcutaneous glucose sensor assembly and through a hole in the printed circuit board.

A portable electronic device, and an image-capturing device and an assembly method thereof are provided. The image-capturing device includes a carrier substrate, an image sensing chip, a filter element and a lens assembly. The carrier substrate has a through opening and a recessed space. The image sensing chip is disposed on the bottom side of the carrier substrate. The filter element is disposed in the recessed space of the carrier substrate, so that all or a part of the filter element is accommodated in the through opening. When at least one microparticle with a maximum particle size between 5 μm and 25 μm is located on the filter element, a shortest distance between the filter element and the image sensing chip is between 30 μm and 200 μm, so that the image sensing chip cannot capture a light spot generated due to blocking of the microparticle.

A display apparatus includes a display panel having an image acquisition region within a display area, and an image acquisition device over a side of the display panel opposing to its display surface. The image acquisition device is at a position corresponding to the image acquisition region, and is configured to capture an image based on lights from an outside pattern over a side of the display panel proximal to the display surface. The display panel includes a substrate and a plurality of light-emitting elements over the substrate. The plurality of light-emitting elements comprises one or more first light-emitting elements positionally within the image acquisition region. At least one first light-emitting element includes a non-transparent electrode provided with at least one through-hole configured to allow the lights from the outside pattern to pass through the display panel.

A substrate for mounting electronic element includes: a first substrate including a first surface and a second surface opposite to the first surface; a second substrate including a third surface and a fourth surface opposite to the third surface; and heat dissipation bodies each including a fifth surface and a sixth surface opposite to the fifth surface. The first substrate includes at least one mounting portion for at least one electronic element at the first surface. Heat conduction of the heat dissipation bodies in a direction perpendicular to a longitudinal direction of the at least one mounting portion and perpendicular to a direction along opposite sides of the second substrate is greater than heat conduction of the heat dissipation bodies in the longitudinal direction of the at least one mounting portion and in the direction along opposite sides of the second substrate in a transparent plan view of the substrate.

Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.