A touch sensor for a cursor control device includes a support layer, a first printed layer, and a second printed layer. The support layer includes a first surface and a second surface opposite from the first surface. The first printed layer includes a first conductive ink and is printed on the first surface of the support layer. The first printed layer includes a printed surface opposite from the support layer, and the printed surface of the first printed layer defines a touch area of the touch sensor. The second printed layer includes a second conductive ink and is printed on the printed surface of the first printed layer. The second printed layer is electrically connected to the first printed layer and forms a border around the touch area.

An optical sensor according to an embodiment of the present disclosure includes a light emitting substrate and a circuit board. The light emitting substrate includes a light emitting device. The circuit board is provided at a position opposing the light emitting device. The circuit board includes a light transmitting section and one or multiple light receiving devices. The light transmitting section transmits light of the light emitting device. The one or multiple light receiving devices receive light reflected by a reflective layer of the light of the light emitting device exiting through the light transmitting section. For example, the one or multiple light receiving devices are formed on a first major surface of the circuit board. For example, the light emitting substrate is disposed at a position opposing a second major surface, of the circuit board, on an opposite side to the first major surface, and is stacked on the circuit board with a first bump interposed therebetween.

A display device includes a display panel and a lower member disposed under the display panel. The lower member includes a support layer, a digitizer, a flexible circuit board, and a metal layer. The digitizer is disposed under the support layer having an insulating property. The flexible circuit board is connected to the digitizer. The metal layer is disposed under the digitizer, and an opening is defined through the metal layer to correspond to the flexible circuit board.

A scanner for scanning a dental site comprises a base, a detector mounted to the base, and an optical element to redirect light reflected off of the dental site towards the detector along a detection axis in a first direction. Two or more flexures couple the optical element to the base, wherein thermal expansion or contraction of the optical element with respect to at least one of the detector or the base bends each flexure of the two or more flexures in a respective second direction without bending the flexure in a respective third direction approximately perpendicular to the first direction and the respective second direction, wherein the two or more flexures maintain an alignment of the optical element to the detector with changes in temperature.

An electronic control module, particularly for a transmission, includes a first circuit board element and a sensor unit carrier fastened to the first circuit board element. The sensor unit carrier has a sensor unit receptacle configured to receive a sensor unit. The sensor unit has a sensor element fastened and electrically connected to a second circuit board element so as to detect at least one measured value. The sensor unit is fastened in the sensor unit receptacle. The second circuit board element has a flexible region that separates a first sub-region of the second circuit board element from a second sub-region of the second circuit board element. The first sub-region has a predetermined angle to the second sub-region. The sensor element is electrically connected to the first circuit board element by the second sub-region of the second circuit board element.

A strain gauge includes a substrate made from resin and having flexibility, a resistor formed on one surface of the substrate, and an insulating resin layer covering the resistor, wherein the insulating resin layer is a thermoplastic polyimide layer.

A device includes an elastic base, a device body provided on the base, a wiring line provided on the base, a coupling member coupled to the wiring line, and an electrically conductive adhesive layer provided between the wiring line and the coupling member. The wiring line extends from the electrically conductive adhesive layer to the device body. The wiring line has a wiring portion overlapping with the electrically conductive adhesive layer. The degree of polymerization of the electrically conductive adhesive layer decreases in the extending direction of the wiring portion.

A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed on the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupled to the sensor chip and the circuit board, and a cover that overcovers the sensor chip and the wires. The cover includes a light-permeable sheet and an opaque frame. The light-permeable sheet has a ring-shaped notch recessed in an edge of an inner surface thereof. The opaque frame is formed on the ring-shaped notch and is disposed on the circuit board, the light-permeable sheet and the sensor chip are spaced apart from each other, and the sensor chip and the wires are arranged in a space that is defined by the light-permeable sheet and the opaque frame.

A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to the circuit board, a sensor chip and an extending wall both assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The extending wall surrounds the sensor chip and has an extending top surface that is substantially flush with a top surface of the sensor chip. The supporting adhesive layer is in a ringed shape and is disposed on the extending top surface of the extending wall and the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer, so that the light-permeable sheet, the supporting adhesive layer, and the top surface of the sensor chip jointly define an enclosed space.

A modular user interface unit for an appliance is provided. The modular user interface unit includes an upper film layer comprising a conductive polymer and a plurality of electrodes. The modular user interface unit also includes a circuit board with a microcontroller thereon. The circuit board is electrically coupled to the upper film layer by a conductive polymer connector. The microcontroller is configured to receive raw capacitance data from the plurality of electrodes and to detect a touch based on the raw capacitance data.