According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

Disclosed are apparatus comprising a substrate and techniques for fabricating the same. The substrate may include a first metal layer having signal interconnects on a first side of the substrate. A second metal layer may include ground plane portions on a second side of the substrate. Conductive channels may be formed in the substrate and coupled to the ground plane portions. The conductive channels are configured to extend the ground plane portions towards the signal interconnects to reduce a distance from individual signal interconnects to individual conductive channels. The distance may be in a range of seventy-five percent to fifty percent of a substrate thickness between the first metal layer and the second metal layer.

An integral toolless-installation Compression Attached Memory Module (CAMM) bolster plate has a generally flat, parallelepiped body portion configured to contact one surface of a CAMM Printed Circuit Board (PCB) and provide compression between the CAMM and a z-axis compression connector. The bolster plate body defines (a) ramped keyhole(s), each ramped keyhole converts lateral displacement of the toolless-installation CAMM bolster plate into vertical displacement, providing the compression between the CAMM and the z-axis compression connector, by the ramped keyhole(s) sliding along (a) bottom face(s) of (a) head(s) of (a) fixed standoff(s) extending from an information handling system (IHS) PCB, through the z-axis compression connector and the CAMM PCB. The integral toolless-installation CAMM bolster plate may lock in place, laterally displaced, to maintain the compression between the CAMM and the z-axis compression connector. The integral toolless-installation CAMM bolster plate may also have a flange portion extending generally perpendicular from the body portion.

A printed circuit board, in which two or more copper clad laminates (CCLs) are laminated vertically from an uppermost circuit layer to a lowermost circuit layer, includes a non-destructive testing area, mislamination identifying portions in the non-destructive testing area, the mislamination identifying portions being in the CCLs, respectively, through-via holes vertically exposing the mislamination identifying portions, respectively, in the non-destructive testing area, the through-via holes being spaced apart from each other by a first interval, and a probe via extending vertically and being in contact with an end portion of each of the mislamination identifying portions on a same side. A length of the mislamination identifying portion in an N-th (N is an integer of 1 to K) layer CCL in a horizontal direction is longer than a length of the mislamination identifying positioned in an (N-1)-th layer CCL in the horizontal direction.

An electronic module includes a first wiring board, a second wiring board, and an intermediate connection member. The intermediate connection member includes an insulator, a plurality of first wirings supported by the insulator and arranged at intervals in a second direction intersecting a first direction, a plurality of second wirings supported by the insulator and arranged at intervals in the second direction, and a metal layer supported by the insulator and interposed between the plurality of first wirings and the plurality of second wirings so as to oppose the plurality of first wirings and the plurality of second wirings in a third direction intersecting the first direction and the second direction. A part of the metal layer sandwiched in the insulator is bonded to one of the first wiring board or the second wiring board by a conductive first bonding member.

Embodiments relate to the field of semiconductors, and provide a semiconductor device and a storage system. The semiconductor device includes a first printed circuit board and a capacitor structure positioned on the first printed circuit board. The first printed circuit board includes a plurality of memories arranged in sequence along a first direction, and each of the memories has a first power terminal and a first ground terminal. The capacitor structure includes a plurality of capacitors, and each of the capacitors has a second power terminal corresponding to the first power terminal and a second ground terminal corresponding to the first ground terminal, wherein the first power terminal is electrically connected to the second power terminal, and the first ground terminal is electrically connected to the second ground terminal. The semiconductor device can at least solve a problem of capacitor arrangement space, which is advantageous to optimizing power quality.

A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.

Technologies for allocating resources of managed nodes to workloads to balance multiple resource allocation objectives include an orchestrator server to receive resource allocation objective data indicative of multiple resource allocation objectives to be satisfied. The orchestrator server is additionally to determine an initial assignment of a set of workloads among the managed nodes and receive telemetry data from the managed nodes. The orchestrator server is further to determine, as a function of the telemetry data and the resource allocation objective data, an adjustment to the assignment of the workloads to increase an achievement of at least one of the resource allocation objectives without decreasing an achievement of another of the resource allocation objectives, and apply the adjustments to the assignments of the workloads among the managed nodes as the workloads are performed. Other embodiments are also described and claimed.

A printed circuit (PC) card apparatus can, in an absence of external power provided to a Peripheral Component Interconnect Express (PCIe) PC card, prevent and detect unauthorized access to secure data stored on a memory device mounted on the PCIe PC card. The PCIe card includes a primary battery to supply, when external power is disconnected from the PCIe card, power to an electronic security device mounted on the PCIe card. The PC card apparatus also includes a PCIe edge connector protector enclosing electrically conductive fingers of a PCIe edge card connector. The PCIe edge connector protector includes a hidden supplemental charge storage device integrated into the PCIe edge connector protector. The PCIe edge connector protector also includes electrically conductive contacts to transfer supplemental power from the supplemental charge storage device to the electronic security device.

Methods and apparatus for GDDR (Graphics Double Date Rate) memory expander using compression mount technology (CMT) connectors. A CMT connector with a dedicated pinout for GDDR-based memory is provided that enables end users and manufacturers to change the amount of GDDR memory provided with a GPU card, accelerator card, or apparatus having other form factors. Memory could also be replaced in the event of a failure. In addition, embodiments are disclosed that support a split channel concept where there could be multiple devices (e.g., GDDR modules) with dedicated signals routed to each module.