One feature pertains to a modular design of a motherboard for a computer system. The mother board is disaggregated into a CPU board and an IO board. The CPU board contains at least one CPU, the associated memory subsystem and the voltage regulator module. The integrated IO ports escape to a high speed connector mating with its counterpart on an IO board which contains all peripheral devices including system logic not part of the CPU. In a multi-socket configuration the CPUs are on the CPU board and the processor interconnects are routed directly in a point to point manner.

A capacitor bank structure includes a plurality of capacitors, a protection material, a first dielectric layer and a plurality of first pillars. The capacitors are disposed side by side. Each of the capacitors has a first surface and a second surface opposite to the first surface, and includes a plurality of first electrodes and a plurality of second electrodes. The first electrodes are disposed adjacent to the first surface for external connection, and the second electrodes are disposed adjacent to the second surface for external connection. The protection material covers the capacitors, sidewalls of the first electrodes and sidewalls of the second electrodes, and has a first surface corresponding to the first surface of the capacitor and a second surface corresponding to the second surface of the capacitor. The first dielectric layer is disposed on the first surface of the protection material, and defines a plurality of openings to expose the first electrodes. The first pillars are disposed in the openings of the first dielectric layer and protrude from the first dielectric layer.

According to one embodiment, a semiconductor storage device includes a housing, a first board, a heat generating component, an electronic component, and a thermal-conductive sheet. The housing has a first vent hole. The first board is accommodated in the housing. The heat generating component is mounted on the first board. The electronic component is disposed between the heat generating component and the first vent hole. The thermal-conductive sheet is provided to extend over the heat generating component and the electronic component, or provided to extend from a region positioned on a rear side of the heat generating component on the first board to the electronic component.

According to one embodiment, a semiconductor storage device includes a plurality of terminals. The plurality of terminals form at least a first row and a second row. The first row includes a plurality of terminals arranged in a first direction at intervals from each other at locations closer to a first end edge than to a second end edge. The second row includes a plurality of terminals arranged in the first direction at intervals from each other at locations closer to the second end edge than to the first end edge. An area between the first row and the second row on a first surface includes a contact area that is in contact with a heat-conducting member, which is disposed on a printed circuit board in a host device that is electrically connected to the semiconductor storage device.

One aspect provides a printed circuit board (PCB). The PCB includes a transmission line to transmit signals of a desired frequency, a first stub coupled to the transmission line at a first location, and a second stub coupled to the transmission line at a second location. The first stub is to filter out signals of a first frequency, the second stub is to filter out signals of a second frequency, and the first and second stubs are positioned such that an insertion loss of the transmitted signals of the desired frequency is substantially minimized.

A flexible printed circuit (FPC) for a hard disk drive includes a plurality of electrical traces, whereby aggressor traces are isolated from victim traces to avoid crosstalk that could degrade signals. Aggressor traces may be positioned together at one of the edges of each of the top wiring layer and the bottom wiring layer, physically isolated from victim traces. Aggressor traces may be grouped together at either the top wiring layer or the bottom wiring layer, with the victim traces positioned on the layer opposing the aggressor traces. With aggressor and victim traces routed on the same wiring layer, aggressor traces may be routed away from the victim traces with multi-layer routing, by way of vias.

Examples described herein relate to a system that includes: a circuit board comprising a plurality of layers, first and second conductive connections, first and second trace portions, first, second, and third routings, and a via wherein: the first conductive connection is coupled to the first trace portion, the second conductive connection is coupled to the second trace portion, the first routing is formed in a first layer of the plurality of layers, the second routing is formed in a second layer of the plurality of layers, the third routing is formed in the first layer of the plurality of layers, a portion of the first routing overlaps with a portion of the second routing to provide a capacitive region, and the via conductively couples a portion of the second routing overlaps with a portion of the third routing.

Disclosed is an active cooling storage device comprising: a memory having memory chips; a thermal pad attached to the memory chips; a heat dissipater having a heat sink and a metal base, a receiving concave being provided between the heat sink and the metal base, the metal base being contacted with a bottom surface of the heat sink an upper surface of the thermal pad; a thermoelectric cooler, which is disposed within the receiving concave in such a manner that a cold side of the thermoelectric cooler facing an upper surface of at least one of the memory chips and facing toward the metal base, and a hot side of the thermoelectric cooler facing toward the heat sink; and a cooler controller, which receives a memory temperature value of the memory, and controlling the thermoelectric cooler to be activated when the memory temperature value is higher than a threshold temperature value.

A multiple-damascene structure is located below a semiconductor device footprint on a printed wiring board, where the structure includes multiple recesses that containing useful devices coupled to a semiconductive device.

Electronic device fastening systems that enable one or more electronic devices to be reliably and quickly secured on a host board and electronic systems made of the same. In a specific exemplary embodiment, a retainer clip spans across the width of one or more electronic devices, engages with the board and snaps into place. The clip includes one or retaining posts such that when the clip engages the board, the one or more retaining posts align and engage with a predefined mounting feature of a corresponding one of the one or more electronic devices, thereby securing the electronic device in place to restrict horizontal, lateral, and vertical movement of the electronic device.